Electron Emitter Chip Geometry for Stable Needle Bonding
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Solution Overview
Problem
Existing electron sources face challenges in efficiently manufacturing fine chips that meet the demand for miniaturization.
Innovation Solution
A method involving cutting a chip from a block of electron-emitting material using an ion beam to form grooves, fixing the chip to a support needle, and sharpening the end portion to secure a sufficient joint area, utilizing focused ion beam processing and bonding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the chip size is reduced to meet miniaturization demands, then the electron source becomes more compact and fine, but the joint area between the chip and support needle becomes insufficient, leading to potential separation
Solution Approach 1:
The chip is designed with a predetermined angle (10 to 85 degrees) between its first and second surfaces before mounting, which pre-configures the first end portion to provide sufficient bonding area when fixed to the support needle, ensuring joint stability before the actual mounting occurs
Solution Approach 2:
The chip structure is made non-uniform by creating a specific angle between the first and second surfaces, concentrating the bonding area at the first end portion while maintaining a fine overall chip size, thus achieving both miniaturization and reliable jointing
2Manufacturing precision
If conventional cutting methods are used to manufacture fine chips, then the manufacturing process is simpler, but the precision and efficiency of producing very fine chips is insufficient
Solution Approach 1:
Conventional mechanical cutting methods are replaced with ion beam irradiation to form grooves and shape the chip, enabling precise manufacturing of very fine chips with controlled dimensions and angles without mechanical contact that would limit precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient production of a very fine electron source with a stable joint, addressing the need for miniaturization and ensuring long-term stable electron emission.
Implementation Method 1
forming a first groove constituting a first surface of the chip in the block by irradiating a surface of the block with an ion beam
Implementation Method 2
sharpening a second end portion of the chip fixed to the distal end surface
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3(a)~3(c)
AI summary
A manufacturing method for an electron source according to the present disclosure includes steps of: (A) cutting out a chip from a block of an electron emission material, (B) fixing a first end portion of the chip to a distal end of a support needle, and (C) sharpening a second end portion of the chip. The step (A) includes forming first and second grooves which constitute first and second surfaces of the chip in the block by irradiating a surface of the block with an ion beam. The first end portion of the chip includes the first surface and the second surface with the surfaces forming an angle α of 10 to 90°. The step (B) includes forming a joint between the distal end of the support needle and the first end portion of the chip.