Electronic Device Air Guide Assembly for Adaptive Heat Dissipation
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Solution Overview
Problem
Current fan modules in electronic devices are ineffective in efficiently dissipating heat generated by power supply modules, leading to inefficient heat dissipation.
Innovation Solution
An electronic device with a housing, fan module, partition, and air guide assembly, featuring adjustable air guide blades that rotate to adjust airflow volumes based on temperature differences between heat sources, controlled by a controller and driven by a driving member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single fan module is used for heat dissipation, then the device structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The patent divides the internal space into multiple sub-spaces using partitions, with each sub-space containing heat sources that can be independently controlled. The air guide assembly can adjust airflow distribution to different sub-spaces separately, allowing targeted heat dissipation for each heat source group, thereby improving heat dissipation efficiency without requiring multiple fan modules.
2Device complexity
If fixed airflow distribution is used, then the control structure is simple, but the adaptability to different heat sources is poor
Solution Approach 1:
The air guide assembly incorporates adjustable air guide blades that can dynamically change the airflow distribution ratio to different sub-spaces. The controller receives temperature signals from temperature sensors and automatically adjusts the air guide blade positions to optimize airflow allocation according to the actual heat generation status of different heat sources, achieving adaptive heat dissipation control.
Solution Approach 2:
The system includes temperature sensors that continuously monitor the temperature of heat sources and feed this information back to the controller. Based on the temperature feedback, the controller adjusts the air guide assembly to optimize airflow distribution, forming a closed-loop control system that adapts to changing thermal conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient heat dissipation is achieved by automatically adjusting airflow volumes to match heat source temperatures, enhancing the heat dissipation effectiveness.
Implementation Method 1
The fan module is configured to generate an airflow toward the opening
Implementation Method 2
The air guide blades are configured to rotate to adjust air volumes of the first sub-airflow and the second sub-airflow
Data Source
AI summary
An electronic device includes a housing, a fan module, a partition, two heat sources, and an air guide assembly. The housing has an internal space and an opening communicated with each other. The fan module is fixed to an outside of the housing and configured to generate an airflow toward the opening. The partition is disposed in the internal space. The partition divides the internal space into first and second sub-spaces, and is configured to branch the airflow into first and second sub-airflows to the first and second sub-spaces, respectively. The two heat sources are respectively disposed in the first and second sub-spaces. The air guide assembly is disposed at the opening and includes a plurality of air guide blades. The air guide blades are configured to rotate to adjust air volumes of the first and second sub-airflows.