Electronic Apparatus Ventilation via Adjacent Casing Vents
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Solution Overview
Problem
Conventional electronic apparatuses with printed-circuit boards dividing the inner space face challenges in heat dissipation efficiency when adjacent units are arranged in parallel, as air flow is restricted, and the mounting area is reduced due to the need for vents, making it difficult to accommodate high heat-generating or low heat-resistant components.
Innovation Solution
The electronic apparatus is designed with a structure where adjacent casings are in communication through side wall vents, allowing air to flow between spaces with different ventilation amounts, enabling improved heat dissipation by promoting airflow between adjacent units without the need for additional vents on the printed-circuit board, thus enhancing overall heat dissipation efficiency and maintaining a higher component density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a printed-circuit board is placed to divide the inner space of the casing, then the mounting area for electronic components is reduced due to the need for vents, but the heat dissipation efficiency is improved
Solution Approach 1:
The inner space of the casing is divided into multiple spaces by the printed-circuit board, allowing different ventilation paths to be created. This segmentation enables air to flow through different regions (first space, second space, third space) with varying ventilation amounts, improving heat dissipation efficiency while maintaining mounting area through strategic vent placement in the casing rather than on the board itself
2Quantity of substance
If vents are provided in the printed-circuit board to enable heat dissipation, then the mounting area for electronic components is reduced, but the ventilation amount is increased
Solution Approach 1:
The venting function is extracted from the printed-circuit board and relocated to the casing. By providing vents in the upper and lower surfaces of the casing rather than on the printed-circuit board itself, the invention maintains full mounting area on the board while still achieving effective ventilation and heat dissipation through the divided spaces
3Volume of stationary object
If electronic apparatuses are arranged in parallel with side walls in contact, then the space utilization is improved, but the heat dissipation efficiency is reduced due to restricted air flow
Solution Approach 1:
The invention creates nested ventilation paths where air flows through multiple divided spaces (first space, second space, third space) within each apparatus. The printed-circuit board divides the inner space to create these nested pathways, allowing air to traverse through adjacent spaces while the apparatuses remain tightly arranged in parallel, thus maintaining both space utilization and heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases ventilation between adjacent electronic apparatuses, supporting heat dissipation and preventing a reduction in heat dissipation efficiency, allowing for the mounting of low heat-resistant components while maintaining a higher component density and reducing the need for additional vents, thereby improving the overall performance and reducing the mounting area requirements.
Implementation Method 1
a cooling fan which draws air from outside the casing into the first space and discharges the air into the third space
Implementation Method 2
a heat-generating component which generates heat and whose heat dissipation is supported by air in the second space
Implementation Method 3
the effect of directly helping an adjacent electronic apparatus in heat dissipation is not obtained
Data Source
AI summary
An electronic apparatus has a plurality of basic structures arranged adjacent to each other in a direction perpendicular to a gravitation direction. Each of the basic structures includes a casing, a board placed parallel to the gravitation direction inside the casing, a first space with large ventilation amount and a second space with small ventilation amount formed by the board dividing the inner space of the casing, vents in the upper and lower surfaces of the casing, an electronic component placed on the board in the first space, and an electronic component placed on the board in the second space. The casings of adjacent basic structures are in communication through inner vents in respective side walls of the casings, and external vents in communication with the outside are provided in left and right side walls of the electronic apparatus.