Electronic Apparatus Frame Heat Radiation and Vibration Isolation

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Solution Overview

Problem

Conventional electronic apparatuses with cooling fans often fail to effectively utilize the frame as a heat radiation member due to inadequate heat transfer, and they transmit vibrations to other devices, such as hard disk drives, through the frame.

Innovation Solution

The electronic apparatus features a circuit board attached to a plate-like frame with a cooling fan positioned on the opposite side, where the cooling fan's rotation axis is perpendicular to the circuit board, and a cover that defines an air flow path with the frame, allowing heat to be transferred from the heat sink to the frame and then to the outside, while minimizing contact between the cooling fan and the frame to reduce vibration transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the cooling fan is attached directly to the frame, then the structure is simple and easy to manufacture, but the vibration of the cooling fan is transmitted to other devices through the frame

Engineering Contradiction:
Improvestructural simplicityVSAvoidvibration transmission
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a vibration-absorbing member as an intermediary between the cooling fan and the frame. This member has a vibration-absorbing portion that contacts the cooling fan and a frame-contacting portion that contacts the frame, acting as a mediator to reduce vibration transmission while maintaining structural simplicity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The vibration-absorbing member changes the mechanical coupling parameters between the cooling fan and frame. By using a material or structure with specific vibration-absorbing properties, it modifies the transmission characteristics to reduce harmful vibrations while maintaining structural integrity

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the frame is used as a heat radiation member, then the cooling efficiency is improved, but the heat transfer from the heat sink to the frame is insufficient

Engineering Contradiction:
Improveheat radiation efficiencyVSAvoidheat transfer efficiency
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent introduces a heat transfer member as an intermediary between the heat sink and the frame. This member has a heat sink-contacting portion that contacts the heat sink and a frame-contacting portion that contacts the frame, improving heat transfer efficiency while enabling the frame to function as an effective heat radiation member

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If the cooling fan is positioned with rotation axis perpendicular to the circuit board, then the air flow path is optimized, but the contact area between the cooling fan and frame increases vibration transmission

Engineering Contradiction:
Improvecooling performanceVSAvoidvibration transmission
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The vibration-absorbing member serves as a mediator that allows the cooling fan to maintain its optimal perpendicular orientation for cooling performance while reducing the transmission of vibrations to the frame and other devices

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat radiation efficiency by utilizing the frame effectively and reduces vibration transmission to other devices, improving both cooling performance and device stability.

Implementation Method 1

heat transferred from the heat sink to the frame is transferred to the outer side of the cover as well through the frame

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a cooling fan for cooling electronic parts on a circuit board

Methodology Applied
Scientific EffectForced convection: Forced Convection

Data Source

PatentEP2701479B1Electronic apparatus
Publication Date: 2018.07.04 SONY INTERACTIVE ENTERTAINMENT LLC
  • EP2701479B1 patent drawingFigure 1
  • EP2701479B1 patent drawingFigure 2
  • EP2701479B1 patent drawingFigure 3

AI summary

Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.