Electronic Assembly Sealing with Flexible Sleeve and Crimp Fixation
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Solution Overview
Problem
Existing methods for producing electronic assemblies are not cost-effective and lack simplicity in automation, often resulting in inefficient sealing and mechanical fragility due to the use of materials like epoxy resin.
Innovation Solution
A method involving a housing with a plug, electronics board, and sensor board assembly, where the plug pins are crescent-shaped for stable contact, and an injection-molded sleeve provides effective sealing and flexibility, allowing for automated assembly and easy disassembly, using low-pressure injection-molding and selective soldering for efficient production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used for sealing electronic components, then sealing effect is achieved, but mechanical fragility increases and ease of repair deteriorates
Solution Approach 1:
The patent changes the material parameter from epoxy resin to flexible polyurethane foam, which maintains the sealing function while improving mechanical flexibility and ease of repair. The foam material provides both sealing effectiveness and mechanical resilience without the fragility of epoxy resin.
2Reliability
If complex assembly methods are used, then sealing and fixation are achieved, but productivity decreases and manufacturing complexity increases
Solution Approach 1:
The patent merges the sealing function and the structural support function into a single flexible foam component. This integration eliminates the need for separate sealing materials and structural supports, simplifying the assembly process and improving productivity while maintaining reliable sealing and fixation.
Solution Approach 2:
The flexible foam automatically adapts to the housing cavity and secures the electronic components in place through its elastic properties. This self-adjusting characteristic eliminates the need for complex fixation mechanisms, allowing for simpler assembly procedures and higher production efficiency.
3Strength
If traditional crimping and threading methods are used, then mechanical connection is achieved, but device complexity increases and ease of manufacture deteriorates
Solution Approach 1:
The patent replaces traditional mechanical connection methods (crimping and threading) with a flexible foam-based securing mechanism. The foam's elastic properties provide sufficient mechanical connection strength without requiring complex crimping tools or threaded fasteners, greatly simplifying the manufacturing process.
Data Source
AI summary
An electronic assembly comprises a housing, a plug, an electronics board, a sensor board, and a front cap; wherein the housing includes, from a rear side to a front side thereof, in succession the plug, the electronics board, the sensor board, and the front cap; wherein a collar, on which an axial end face of the plug is supported, is provided at the rear side of the housing such that the plug cannot be pulled out from the rear side of the housing; wherein the plug, the electronics board, and the sensor board form an assembled structural unit; and wherein a front of the housing is crimped around the front cap to fix the structural unit in the housing and press the structural unit against the collar.