Electronic Connection Assembly With Dual-Sided Impingement Cooling
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Solution Overview
Problem
Conventional power electronics devices face limitations in heat extraction and cooling due to fragile wire or ribbon bonding, which restricts double-sided cooling and stacking, leading to lower thermal performance and increased thermal resistance.
Innovation Solution
A housing design with direct liquid impingement cooling for power overlay modules, allowing for dual-sided cooling and improved heat extraction through a modular, sealed assembly that supports high-power density configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire or ribbon bonding is used to connect power components, then the power module can be assembled, but the thermal performance deteriorates due to restricted cooling paths and increased thermal resistance
Solution Approach 1:
The patent extracts the bonding wires from the power module assembly and replaces them with direct tab-to-pad connections. This removal of unnecessary intermediate elements (wires and ribbons) creates direct thermal paths from the power devices to the heat sink, eliminating thermal resistance introduced by the bonding materials and enabling more effective cooling without increasing structural complexity.
2Reliability
If single-sided cooling is used for power electronics devices, then the cooling structure is simpler, but the heat extraction efficiency is insufficient for high-power density configurations
Solution Approach 1:
The patent transitions from single-sided cooling to dual-sided cooling by adding cooling capability in another dimension (the opposite side of the device). The heat sink is configured to contact both the front and back surfaces of the power electronics devices, creating thermal paths in two directions. This dimensional expansion of the cooling approach doubles the heat extraction capacity without proportionally increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat extraction and improved thermal performance by allowing direct contact forced convection on multiple sides of power electronics devices, enhancing cooling efficiency and supporting high-power density configurations.
Implementation Method 1
direct contact forced convection on multiple sides of power electronics devices
Implementation Method 2
efficient heat extraction and improved thermal performance
Data Source
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AI summary
The disclosure relates to an apparatus (11) and method (600) for connecting an electronic component (14) to a conductor (33). A housing (12) includes at least one slot (38) and defines at least one component chamber (52) for carrying the electronic component (14). A liquid coolant (90) can pass through the housing (12). A pair of conductive members (71), (72) extends from the housing (12) via the at least one slot (38) and can be releasably inserted into a channel (60) defined in a support assembly (22). The support assembly (22) facilitates an electrical connection between the conductive members (71), (72) and corresponding conductive contact members (37a), (37b) connected to a respective power supply or electrical load. The support assembly (22) can provide an inward sealing force (80) to a seal on the housing (12) circumscribing the pair of conductive members (71), (72).