Electronic Assembly Injection Molding for Antenna Integration
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Solution Overview
Problem
Current methods for manufacturing electronic assemblies, such as antennas and capacitive sensing devices, require multiple production steps and separate integration into products, which is inefficient and complex.
Innovation Solution
A method involving the arrangement of electrically conductive elements at pre-defined distances within a mold structure, followed by injection molding of a molding material layer between these elements, simplifying the manufacturing process and reducing production steps by integrating the electronic components directly into the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are arranged on a substrate and then overmolded separately, then the electronic assembly can be protected and integrated into products, but the manufacturing process requires multiple production steps and separate integration
Solution Approach 1:
The patent combines the electronic component arrangement and overmolding processes into a single integrated manufacturing step. Conductive elements are placed in a mold cavity and molded directly into the final assembly with the molding material layer, eliminating separate assembly and molding operations. This merging of processes reduces production complexity while maintaining component protection.
Solution Approach 2:
The patent performs preliminary arrangement of conductive elements at pre-defined distances within the mold cavity before the molding process. This preliminary positioning ensures correct spacing and configuration is established before final assembly, allowing the molding material to be applied in a single step that simultaneously protects components and integrates them into the final structure.
2Reliability
If multiple separate metal parts and insulating support parts are used to create an antenna device, then the antenna can be overmolded and integrated into a product, but the manufacturing process becomes complex with multiple components
Solution Approach 1:
The patent merges multiple separate metal parts (radiator, feeding element, ground plane) and insulating support parts into a single integrated antenna device. All conductive elements are arranged within the mold cavity and molded together with the molding material, creating a unified structure that eliminates the need for separate assembly of multiple components while maintaining antenna functionality.
Solution Approach 2:
The patent uses composite construction by combining conductive elements with molding material in a single integrated structure. The molding material layer integrates with the metal parts to form a unified antenna device, where the molding material serves both as structural support and as the final product housing, reducing the need for separate insulating support parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient manufacturing of multilayer electronic assemblies like antennas and capacitive sensing devices with optimized operational characteristics, reducing production complexity and increasing manufacturing efficiency.
Implementation Method 1
molding, such as injection molding, a molding material layer at least between said electrically conductive elements
Data Source
AI summary
A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.