Electronic Assembly Sealing for Transmission Control Modules
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Solution Overview
Problem
Existing electronic assemblies for transmission control modules are not robust, have high manufacturing costs, and are prone to mechanical stresses and precision issues due to the use of covers or chip protection covers, which affect their oil-tightness and service life.
Innovation Solution
A method involving a printed circuit board with a high viscosity, non-flowable caulking material applied to one side, surrounding a portion of the board, and a second component pressed into this material for electrical connection, followed by a free-flowing covering material to ensure oil-tightness and electrical insulation, eliminating the need for chip protection covers and reducing mechanical stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If covers or chip protection covers are used to seal the electronic assembly, then oil-tightness is improved, but device complexity and manufacturing costs increase
Solution Approach 1:
The patent removes the cover component entirely and replaces it with a sealing material applied directly to the circuit board. This extraction of the unnecessary cover element simplifies the assembly structure while maintaining the oil-tight sealing function through the curing sealing material.
Solution Approach 2:
The patent changes the physical state of the sealing material from liquid (before curing) to solid (after curing) to achieve the sealing function. This parameter change allows the material to flow into sealing positions initially, then harden to provide permanent oil-tightness without requiring a separate cover component.
2Reliability
If covers are used to protect components, then oil-tightness is improved, but manufacturing costs increase
Solution Approach 1:
The patent replaces expensive metal or plastic covers with a cost-effective sealing material that is applied directly to the circuit board. This disposable-like approach uses a simple material layer instead of costly reusable cover components, reducing manufacturing costs while maintaining sealing effectiveness.
3Stability of the object's composition
If mechanical fastening methods are used to attach components, then connection stability is improved, but mechanical stresses increase
Solution Approach 1:
The patent replaces mechanical fastening methods (screws, clips, rivets) with a chemical bonding approach using curing sealing material. The material chemically bonds to both the circuit board and component, providing stable connection without the mechanical stresses and potential damage associated with physical fasteners.
4Strength
If thick printed circuit boards are used to support components, then structural strength is improved, but placement precision decreases
Solution Approach 1:
The patent changes the viscosity parameter of the sealing material from low (flowable) to high (non-flowable) after application. This allows the material to be applied precisely to the desired location on the circuit board without spreading, maintaining placement precision even on thicker boards that may have height variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a robust, cost-effective, and long-lasting electronic assembly with permanent oil-tightness and improved thermal dissipation, allowing precise placement and reduced mechanical stresses, enhancing the assembly's stability and manufacturing simplicity.
Implementation Method 1
Applying a high viscosity, non-flowable prior to curing caulking material to the first side, the caulking material not flowing after application
Implementation Method 2
curing the sealing material
Implementation Method 3
Application of a covering material, in particular a covering material that is free-flowing before curing, to the partial area of the first side of the printed circuit board surrounded by the sealing material and to the first component
Implementation Method 4
curing the covering material
Data Source
Figure 1~3
Figure 4~5
AI summary
The invention relates to a method for producing an electronic assembly (5), in particular for a transmission control module, having the following steps: providing a printed circuit board (10) with a first face (12) and a second face (14) facing away from the first face (12) and with at least one first electronic component (70) arranged on the first face (12) of the printed circuit board (10); arranging the printed circuit board (10) such that the second face (14) lies at least partly on a reference surface (40); applying a sealing material (50) which is substantially not flowable prior to being cured onto the first face (12), said sealing material (50) being applied such that the sealing material (50) surrounds a sub-region (20) of the first face (12) of the printed circuit board (10); arranging a second component (80) at least partly on the reference surface (40) such that the second component (80) is at least partly pressed into the sealing material (50); electrically connecting the second component (80) to the printed circuit board (10) by means of an electric connection line (85); applying a covering material (60), in particular a covering material (60) which is flowable prior to being cured, onto the printed circuit board (10) first face (12) sub-region (20) surrounded by the sealing material (50) and onto the first component (70); curing the sealing material (50); and curing the covering material (60).