Electronic Board Heat Sink Assembly With Through-Openings

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Solution Overview

Problem

Existing motor-fan units in motor vehicles suffer from bulky and costly heat sinks that provide inadequate cooling efficiency, weight, and manufacturing expenses due to molding processes.

Innovation Solution

The assembly of an electronic card and heat sink is manufactured via extrusion and cutting, featuring a plate with through openings for improved air convection and reduced weight, using thermal paste for better thermal conductivity and airflow, and eliminating the need for screws or rivets for fixation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink with pads is used, then cooling function is provided, but the structure becomes bulky and weight increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidheat sink weight

Core Design Contradiction:

TemperatureVSWeight of stationary object

Solution Approach 1:

The heat sink plate incorporates multiple through-openings that create a porous structure, allowing air flow directly through the plate while maintaining cooling functionality. This eliminates the need for bulky pads and reduces weight while preserving heat dissipation performance.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The heat sink plate is segmented into multiple functional zones with through-openings distributed across its surface. This segmentation allows air flow to be distributed throughout the plate, improving cooling efficiency without requiring additional components like pads.

Inventive Principle:

Principle #1Segmentation

2Temperature

If a heat sink with pads is used, then cooling function is provided, but manufacturing cost increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The through-openings in the heat sink plate can be manufactured using standard punching or laser drilling processes, which are more cost-effective than the molding process required for pads. This reduces manufacturing complexity and cost while achieving the same cooling function.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The heat sink plate integrates the cooling function directly into its structure through the through-openings, eliminating the need for separate pad components. This merging of functions reduces the number of parts and simplifies the manufacturing process, lowering overall cost.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If a heat sink with pads is used, then cooling function is provided, but air convection efficiency is insufficient

Engineering Contradiction:

Improvecooling efficiencyVSAvoidair convection efficiency

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The through-openings create a porous structure that dramatically improves air convection by allowing air to flow directly through the plate. This increases the effective heat exchange surface area and improves cooling efficiency compared to traditional pad-based designs.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The cooling function is extended into the third dimension by creating through-openings that allow air flow from one side of the plate to the other. This vertical air flow path enhances convection efficiency compared to surface-level cooling only.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Temperature

If a heat sink with pads is used, then cooling function is provided, but pressure losses increase

Engineering Contradiction:

Improvecooling efficiencyVSAvoidairflow pressure losses

Core Design Contradiction:

TemperatureVSStress or pressure

Solution Approach 1:

The distributed through-openings create a porous structure that reduces airflow resistance by providing multiple parallel flow paths. This decreases pressure losses compared to the restricted flow paths created by pads.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The plate is segmented into multiple zones with through-openings, creating a distributed flow pattern that reduces localized pressure losses and improves overall airflow efficiency through the heat sink assembly.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances cooling efficiency, reduces weight and manufacturing costs, and improves aeraulic and acoustic performance by minimizing airflow resistance.

Implementation Method 1

the thermal paste, placed between the electronic card and the plate, has a thermal conductivity of between 1 W/mK and 50 W/mK

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat sink serves to cool the electronic board and the electronic components controlling the motor

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentEP4074152B1Assembly of an electronic board and a heat sink, and motor-fan unit comprising such an assembly

Publication Date: 2025.10.22 VALEO ELECTRIFICATION

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AI summary

Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).