Electronic Component Bonding with Organic Film Height Equalization
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Solution Overview
Problem
Conventional solid-phase diffusion bonding methods for electronic components require high pressure and longer bonding times, making it difficult to bond components with varying heights and short terminal pitches, leading to increased production costs and reduced productivity, while hydrostatic pressure methods may not ensure sufficient force for good bonding.
Innovation Solution
An electronic component bonding method involving the application of a metal fine powder paste, followed by the use of an organic film to equalize component heights and apply pressure uniformly, with a compressing member applying a second pressure for sintering, allowing for efficient bonding of components with different heights and short pitches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional solid-phase diffusion bonding is used with separate heaters for each component, then bonding reliability is improved, but device complexity and production cost increase
Solution Approach 1:
Multiple separate heaters and compressors are merged into a single integrated heating plate and pressing member that can simultaneously heat and compress multiple electronic components with different heights, reducing apparatus complexity while maintaining bonding reliability
Solution Approach 2:
The heating plate and pressing member are designed to perform multiple functions: heating, compressing, and accommodating components of varying heights, eliminating the need for separate dedicated devices for each component
2Reliability
If conventional solid-phase diffusion bonding is used with separate heaters for each component, then bonding quality is improved, but productivity decreases
Solution Approach 1:
Multiple bonding operations are combined into a single simultaneous process where the heating plate and pressing member bond multiple components at the same time, dramatically improving productivity while maintaining bonding quality
Solution Approach 2:
The organic film is placed on components beforehand to equalize heights, enabling subsequent simultaneous bonding without requiring complex real-time adjustment mechanisms during the bonding process
3Reliability
If conventional solid-phase diffusion bonding is used, then high electric conductivity and thermal conductivity are achieved, but bonding time increases
Solution Approach 1:
The application of high pressure through the pressing member accelerates the diffusion reaction rate, allowing the bonding process to be completed in a shorter time while still achieving the required electric conductivity and thermal conductivity
4Manufacturing precision
If multiple electronic components with different heights are bonded using conventional methods, then bonding precision is improved, but device complexity increases
Solution Approach 1:
An organic film is introduced as an intermediary material between the heating plate and electronic components with different heights. The film deforms to accommodate height variations, automatically equalizing the contact surface without requiring complex parallelism adjustment mechanisms
Solution Approach 2:
The organic film acts as a flexible intermediary that can deform and adapt to different component heights, providing uniform pressure distribution and maintaining bonding precision without rigid mechanical adjustment systems
5Volume of moving object
If substrate size is reduced for downsizing, then equipment compactness is improved, but bonding difficulty increases
Solution Approach 1:
Multiple bonding operations are merged into a single simultaneous process, reducing the total time and complexity required for bonding on compact substrates with short terminal pitches
Solution Approach 2:
The application of high pressure through the pressing member accelerates the diffusion reaction, enabling reliable bonding on small substrates where heat and pressure distribution would otherwise be difficult to control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a good bonding state between electrode terminals and the substrate, increases productivity, and facilitates substrate downsizing by allowing for one-time heating and compressing, eliminating the need for advanced parallelism adjustments and dedicated pressing members.
Implementation Method 1
a solid-phase diffusion bonding in which a metal fine powder paste is sintered
Implementation Method 2
sintering the metal fine powder paste to bond electrode terminals of the multiple electronic components to the electrodes of the substrate
Implementation Method 3
pressing a pressing surface of a pressing member against the organic film, applying a first pressure to the electronic component side with the pressing member, and equalizing a height of a pressed surface of the organic film
Implementation Method 4
applying a second pressure to the electronic component side with the compressing member on heating for a predetermined time, and sintering the metal fine powder paste
Data Source
AI summary
The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.