Electronic Card Terminal Electrode Offset Layout
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Solution Overview
Problem
Existing electronic identification cards face manufacturing challenges due to the need for unique terminal electrode layouts that are not possible with traditional techniques, particularly in creating an array of terminal electrodes offset from the edges of the contact plate, which complicates the electroplating process and requires innovative solutions for alignment and integration.
Innovation Solution
The electronic identification card features a contact plate with an array of terminal electrodes offset from the edges, where each electrode is electrically coupled to a copper layer on a hidden inner surface, facilitating an electroplating process, and includes a conductive periphery portion separated by ablated regions, allowing for a unique terminal layout and improved manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional electroplating techniques are used to create terminal electrodes, then the manufacturing process is simple and well-established, but it is not possible to create unique terminal electrode layouts offset from the edges of the contact plate
Solution Approach 1:
The contact plate is segmented into multiple functional regions: a copper layer region for electroplating, an ablated region for electrical isolation, and a terminal electrode region. This segmentation allows the copper layer to extend beyond the final terminal electrode boundaries, enabling offset electrode layouts while using conventional electroplating techniques. The ablated region acts as a barrier to prevent electrical connection between adjacent electrodes, solving the layout flexibility problem.
Solution Approach 2:
The copper layer is deposited in advance beyond the intended terminal electrode boundaries before the electroplating process. This preliminary copper extension provides the necessary electrical connectivity for offset electrode arrangements, allowing the electroplating process to create electrodes at non-traditional positions while maintaining manufacturing simplicity.
2Adaptability or versatility
If the contact plate includes a conductive periphery portion separated by ablated regions, then a unique terminal layout is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The ablated region serves as an intermediary element between the copper layer and the terminal electrodes. By removing material in this intermediate zone, the design achieves electrical isolation and structural definition without requiring complex multi-layer PCB techniques or additional manufacturing steps. The ablated region mediates between the simple copper deposit and the functional terminal layout.
3Reliability
If terminal electrodes are offset from the edges of the contact plate, then improved electrical connectivity is achieved, but alignment precision during manufacturing becomes more difficult
Solution Approach 1:
The contact plate exhibits local quality variations: the copper layer has extended reach in certain areas to provide electrical pathways to offset electrodes, while ablated regions provide localized electrical isolation. This localized material distribution enables offset electrode arrangements with reliable connectivity without requiring high-precision alignment throughout the entire structure, as the copper and ablated regions are positioned specifically where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a functional and manufacturable electronic card with a unique terminal layout, enhancing electrical connectivity and manufacturing feasibility while maintaining a compact design.
Implementation Method 1
facilitating an electroplating process
Implementation Method 2
conductive periphery portion separated by ablated regions
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
This disclosure is directed to an electronic identification card (100) or electronic card having various features. The electronic card may include an integrated circuit (106) and a contact plate (102) for electrically interfacing with the integrated circuit (106). The contact plate (102) may include an array of terminal electrodes (104) that are offset with respect to the edges of the contact plate (102). The electronic card may be coated with a coating layer that extends at least partially over a ferromagnetic element or film (130). The electronic card may also include a metal substrate having exposed chamfer portions that may provide a visual contrast to the coating layer and also improve the handling and use of the electronic card (100).