Two-Step Electronic Device Casing with Labyrinth Seal
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Solution Overview
Problem
Existing methods for producing electronic assemblies face challenges in completely sealing them against moisture and weathering influences, often requiring costly carriers and risking damage to the sealing effect during manufacturing.
Innovation Solution
A method involving a two-step casing process where the electronic assembly is first encased with a first material, serving as a support for a holding element, and then sealed with a second material, forming a labyrinth gap to enhance sealing, which can be fused in certain regions for added protection, and incorporating receiving elements for stability and precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic assembly is encased with a single casing material using a carrier, then the sealing effect is intended to protect against moisture, but the carrier must be broken off which destroys the sealing effect and incurs additional manufacturing costs
Solution Approach 1:
The casing is divided into two separate injection molding steps with two different casing materials. The first casing material encases the electronic assembly, and the second casing material encases the first casing material, eliminating the need for a separate carrier and its subsequent removal.
Solution Approach 2:
The first casing material is nested within the second casing material, creating a multi-layer protective structure. The intermediate injection-molded part serves as a holder for the electronic assembly during the second injection molding process, allowing both casing materials to be applied without requiring a separate carrier.
2Object-affected harmful factors
If the electronic assembly is completely encased by one casing material, then protection from moisture is achieved, but costly carriers must be manufactured and broken off which destroys the sealing effect
Solution Approach 1:
The electronic assembly is first encased with the first casing material in a preliminary step. This intermediate casing serves as both protection and as a holder for subsequent processing, allowing the second casing material to be injected while maintaining the integrity of the sealing structure without requiring a separate carrier to be broken off later.
3Ease of operation
If places are kept open for electrical connections, then electrical connectivity is maintained, but the electronic device cannot be completely encased reducing moisture protection
Solution Approach 1:
The first casing material is configured with specific local features such as receiving elements and labyrinth elements that provide both electrical connection access and moisture protection. The labyrinth gap creates a fluidic seal that protects against moisture ingress while allowing electrical connections to pass through or access the electronic assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively seals electronic devices against moisture, maintaining the sealing effect while avoiding costly carrier manufacturing and ensuring the longevity of components like inertial sensors in harsh environments.
Implementation Method 1
the first casing material and the second casing material are configured in such a manner that during the encasing of the first casing material, the second casing material fuses this in certain regions
Implementation Method 2
a tight fit element, called labyrinth element, is formed on the first casing material, which after the encasing by the second casing material forms a labyrinth gap between the first casing material and the second casing material. The sealing effect is based on fluidic effects through the extension of the gap to be sealed. The flow resistance is thereby increased.
Data Source
AI summary
A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.