Automated Electronic Component Alignment Using Fiducial Vision
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Solution Overview
Problem
Existing methods for aligning electronic components with testing devices in high-speed semiconductor assembly and packaging face challenges due to inconsistent orientations and the need for precise manual intervention, leading to misalignment and reduced processing efficiency.
Innovation Solution
An automated alignment method using a fiducial marker and a combination of moveable and stationary imaging devices to determine and adjust offsets between electronic components and testing devices, eliminating the need for manual precision alignment and allowing for automatic alignment of contact points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual precision alignment is used to align electronic components with testing devices, then alignment accuracy is improved, but setup time increases and system throughput decreases
Solution Approach 1:
The patent replaces manual mechanical alignment operations with an automated vision-based system. Imaging devices capture positions of electronic components and testing devices, and a processor automatically calculates and applies alignment adjustments, eliminating the need for manual precision alignment while reducing setup time.
Solution Approach 2:
The system performs self-alignment by automatically detecting the positions of electronic components and testing devices using imaging devices, calculating the required alignment adjustments, and executing the alignment without human intervention. This self-service approach reduces both setup time and labor requirements while maintaining high alignment accuracy.
2Productivity
If testing devices are positioned closer together to increase system throughput, then productivity is improved, but alignment precision between components and devices deteriorates
Solution Approach 1:
The patent uses vision-based detection and automated calculation to determine precise alignment parameters even when testing devices are positioned closely together. The imaging devices capture the actual positions, and the processor calculates the specific alignment adjustments needed for each device, enabling high-density device placement without sacrificing alignment precision.
Solution Approach 2:
The system dynamically adjusts alignment parameters based on the actual detected positions of electronic components and testing devices. By calculating and applying individualized alignment offsets for each device, the system maintains precise alignment even when devices are positioned closer together, thereby enabling increased system throughput without compromising alignment quality.
3Productivity
If automated alignment is implemented to reduce setup time, then system throughput is improved, but device complexity increases
Solution Approach 1:
The patent employs imaging devices that serve multiple functions: capturing positions of electronic components, detecting positions of testing devices, and providing data for alignment calculations. This multi-functionality reduces the need for separate specialized devices, thereby limiting the increase in system complexity while achieving automated alignment and improved throughput.
Solution Approach 2:
The processor acts as an intermediary that receives position data from imaging devices, calculates the necessary alignment adjustments, and translates these calculations into actionable alignment commands. This intermediary role simplifies the overall system architecture by centralizing the complex calculation logic, making the automated alignment system more manageable and easier to implement.
Data Source
AI summary
A method for automated alignment between a plurality of electronic components and at least one testing device for receiving the electronic components for testing which includes defining a fiducial marker and positioning a moveable imaging device relative to a stationary imaging device, such that the fiducial marker is within a field of view of the moveable imaging device and within a field of view of the stationary imaging device. The moveable imaging device determines, with respect to each of the at least one testing device, a first offset between the testing device and the fidicual marker. The stationary imaging device determines, with respect to each electronic component, a second offset between the electronic component and the fidicual marker. Alignment is effected between each electronic component and the testing device in accordance with the first and second offsets.