Electronic Component Alloy Layer Moisture Resistance
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Solution Overview
Problem
Conventional semiconductor devices with solder bump electrodes face moisture ingress issues due to gaps between the resin film and solder bump electrodes, which can affect the component's characteristics.
Innovation Solution
An electronic component design featuring a substrate with a functional element, wiring layer, cover portion, connection electrode, electrically conductive layer, protective film, solder bump, and alloy layer, where the alloy layer differs in composition from the solder bump and is positioned between the solder bump and the electrically conductive layer to enhance moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin film is used to protect the semiconductor element, then the functional element portion is protected, but moisture can still enter through gaps between the resin film and solder bump electrodes
Solution Approach 1:
An alloy layer is introduced as an intermediary between the solder bump electrode and the resin film. This alloy layer fills the gap that would otherwise allow moisture to penetrate, serving as a mediator that both maintains electrical connection and provides moisture barrier functionality.
Solution Approach 2:
The protective structure is transformed from a single resin film into a composite system comprising the resin film, alloy layer, and solder bump electrode. This composite structure combines the protective properties of the resin film with the gap-filling and moisture-blocking properties of the alloy layer.
2Reliability
If solder bump electrodes are connected to the UBM through resin film coverage, then electrical connection is achieved, but gaps form that allow moisture to reach the semiconductor element
Solution Approach 1:
The alloy layer serves as a mediator substance that simultaneously achieves electrical connection and moisture prevention. It fills the space between the solder bump electrode and resin film, providing both conductive pathway and barrier function.
Solution Approach 2:
The alloy layer is selectively positioned in the gap region between the solder bump electrode and resin film, providing localized moisture blocking properties exactly where the vulnerability exists, while maintaining electrical conductivity in the same region.
3Reliability
If the solder bump electrode directly contacts the UBM, then electrical connection is established, but moisture can penetrate through gaps to affect the semiconductor element characteristics
Solution Approach 1:
The alloy layer acts as an intermediary material that provides both electrical conductivity and moisture barrier properties. It is positioned between the solder bump electrode and the resin film to eliminate gaps that would otherwise allow moisture penetration while maintaining the electrical connection pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves moisture resistance by preventing moisture from reaching the functional element, thereby enhancing the reliability and performance of the electronic component.
Implementation Method 1
The alloy layer is provided between the solder bump and the electrically conductive layer in the thickness direction to join the solder bump to the electrically conductive layer
Data Source
AI summary
A electronic component includes a connection electrode on a wiring layer. An electrically conductive layer is connected to the wiring layer via the connection electrode. A protective film covers a cover portion and the electrically conductive layer. A solder bump is electrically connected to the electrically conductive layer via an opening. An alloy layer is between the solder bump and the electrically conductive layer in a thickness direction to join the solder bump to the electrically conductive layer and differs in composition and/or elements from the solder bump. The connection electrode does not overlap the solder bump. The surface of the electrically conductive layer that is located on a protective film side is in contact with the protective film between the alloy layer and an edge of the electrically conductive layer that is located on a connection electrode side.