Electronic Component Asymmetric Connection Patterns
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Solution Overview
Problem
Surface-mount electronic components are prone to rotation during mounting due to surface tension of solder during reflow, especially when the component's height is ⅔ or more of its width, leading to the 'Manhattan phenomenon' where they rotate by 90° about the long-side direction.
Innovation Solution
The electronic component design features a base with terminal electrodes exposed at corner portions and connection patterns embedded within the base, where the connection patterns are exposed on side surfaces perpendicular to the mounting surface, reducing the fillet height on long-side surfaces and increasing it on short-side surfaces, thereby balancing surface tension and preventing rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the height of the electronic component is increased to 2/3 or more of its width, then the component can achieve compact design, but it becomes prone to rotation by 90° during mounting due to surface tension of solder
Solution Approach 1:
The patent applies asymmetry by exposing connection patterns only on the short-side surfaces (third and fourth side surfaces) while keeping the long-side surfaces (first and second side surfaces) free of exposed connection patterns. This asymmetric configuration creates different surface tension distributions that generate a counteracting moment to prevent the component from rotating 90° during mounting, thus resolving the contradiction between compact size and mounting stability.
2Reliability
If connection patterns are exposed on all side surfaces, then electrical connectivity is improved, but surface tension becomes unbalanced causing rotation about the long-side direction
Solution Approach 1:
The patent applies local quality by selectively exposing connection patterns only on specific surfaces (third and fourth side surfaces extending in the first direction) while leaving other surfaces (first and second side surfaces) without exposed connection patterns. This localized exposure ensures electrical connectivity through the exposed patterns while creating an asymmetric surface tension distribution that prevents rotation, thus resolving the contradiction between connectivity and orientation stability.
3Device complexity
If terminal electrodes are disposed at corner portions only, then the base structure is simplified, but the component may still rotate due to unbalanced surface tension on long-side surfaces
Solution Approach 1:
The patent combines corner-positioned terminal electrodes with asymmetrically exposed connection patterns on short-side surfaces only. This configuration maintains the simplified base structure while the asymmetric pattern exposure creates balanced surface tension forces that prevent rotation, resolving the contradiction between structural simplicity and mounting orientation stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the rotation of electronic components about the long-side direction during mounting by managing surface tension, ensuring reliable connection to land patterns and preventing the 90° rotation phenomenon.
Implementation Method 1
surface tension of a solder melted during reflow
Data Source
AI summary
Disclosed herein is a coil component that includes conductor layers embedded in a base and terminal electrodes embedded in the base. Each of the terminal electrodes is exposed to a mounting surface of the base and a respective corner portion of the base. The conductor layers include connection patterns each connected to an associated one of the terminal electrodes. The first connection pattern is exposed to the third side surface without being exposed to the first side surface, the second connection pattern is exposed to the fourth side surface without being exposed to the first side surface, the third connection pattern is exposed to the third side surface without being exposed to the second side surface, and the fourth connection pattern is exposed to the fourth side surface without being exposed to the second side surface.