Electronic Component Device Baked Metal Layer Crack Resistance

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Solution Overview

Problem

Electronic component devices experience cracking in their base bodies due to bending, which is not effectively addressed by existing technologies.

Innovation Solution

Incorporating a metal portion with a baked metal layer on the side surfaces of the electronic component device, which provides increased rigidity and adhesion, preventing bending and cracking by connecting inner conductors to the baked metal layer and forming capacitance units in specific configurations to detect issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal terminal is electrically connected to the outer electrode of an electronic component, then electrical connectivity is achieved, but bending of the circuit board causes bending in the electronic component which leads to cracks in the base body

Engineering Contradiction:

Improveelectrical connectivityVSAvoidcrack resistance of base body

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining a metal portion with a baked electrode layer to the base body. The baked electrode layer provides adhesion to the base body while the metal portion provides rigidity and strength, creating a composite structure that resists bending-induced cracks while maintaining electrical connectivity through the outer electrodes and metal terminals

Inventive Principle:

Principle #40Composite materials

2Ease of operation

If the electronic component is mounted on a circuit board, then electrical connection is established, but bending of the circuit board transmits stress to the electronic component causing base body cracks

Engineering Contradiction:

Improvemounting capabilityVSAvoidbending stress from circuit board

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies beforehand cushioning by providing a metal portion with baked electrode layer on the base body before mounting occurs. This pre-installed reinforcement structure cushions against bending stresses that will be transmitted from the circuit board during operation, preventing cracks in the base body while maintaining the mounting capability

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Object-affected harmful factors

If the base body is made more flexible to accommodate bending, then bending stress is reduced, but structural strength and rigidity decrease leading to potential failure

Engineering Contradiction:

Improvebending stress resistanceVSAvoidstructural strength of base body

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The patent resolves this contradiction by using composite materials - the base body maintains its original flexibility to accommodate bending, while the added metal portion with baked electrode layer provides the necessary structural strength and rigidity. The baked electrode layer ensures strong adhesion between the metal portion and base body, creating a synergistic composite structure

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS11373807B2Electronic component device

Publication Date: 2022.06.28 TDK CORP

AI summary

An electronic component device includes: an electronic component having: a base body having a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces; and a pair of outer electrodes disposed on respective sides of the pair of end surfaces; metal terminals respectively electrically connected to the pair of outer electrodes; and joint portions joining and electrically connecting the outer electrodes to the metal terminals respectively, wherein the electronic component has a metal portion disposed on at least one surface of the four side surfaces, and the metal portion has a baked metal layer.