Electronic Component Device Heat Dissipation via Bonding
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Solution Overview
Problem
Existing electronic component devices with three or more components mounted between two facing mount boards often experience insufficient heat dissipation due to limited heat dissipation paths, leading to potential deterioration of components affected by heat.
Innovation Solution
The electronic component device incorporates a configuration where at least one electronic component with higher thermal conductivity is positioned to facilitate heat dissipation by contacting and bonding with other components, creating multiple heat dissipation paths, including through a semiconductor component and acoustic wave components, and utilizing a switching function to enhance temperature differences and heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation paths are increased by bonding electronic components together, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent segments the heat dissipation function by introducing multiple independent heat dissipation paths: one path through the mount board and another path through the bonded electronic components. This segmentation allows heat to be dissipated through parallel routes, improving overall heat dissipation performance while keeping each individual path relatively simple.
Solution Approach 2:
The electronic components serve dual functions: they perform their primary electronic functions and simultaneously act as heat dissipation conduits. By bonding components like piezoelectric elements that can serve both signal processing and heat transfer roles, the patent achieves multi-functionality, improving heat dissipation without adding dedicated heat dissipation structures that would increase complexity.
2Temperature
If electronic components are bonded together to create heat dissipation paths, then heat dissipation is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent employs preliminary action by pre-forming bonding surfaces on the electronic components and preparing bonding structures before final assembly. The mount boards and electronic components are prepared with appropriate bonding interfaces in advance, allowing for more efficient bonding processes during manufacturing rather than attempting to create bonds during final assembly.
Solution Approach 2:
The patent introduces bonding structures as intermediaries between electronic components and mount boards. These bonding structures serve as mediators that facilitate the joining process, enabling heat dissipation path creation while simplifying the manufacturing procedure. The bonding structures provide standardized interfaces that make the bonding process more controllable and repeatable.
3Temperature
If multiple heat dissipation paths are created through component bonding, then heat dissipation efficiency is improved, but the number of components and connections increases
Solution Approach 1:
The patent achieves multi-functionality by making electronic components serve dual roles: their primary electronic function and heat dissipation function. Components such as piezoelectric elements are positioned and bonded to create heat dissipation paths while simultaneously performing signal processing or other electronic functions. This eliminates the need for separate dedicated heat dissipation components.
Solution Approach 2:
The patent merges the heat dissipation function with the electronic component structure itself. By bonding electronic components directly to each other and to mount boards, the patent combines the electrical connection function with the thermal conduction function into single integrated structures, thereby creating multiple heat dissipation paths without adding separate heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation by increasing the number of heat dissipation paths and reducing the risk of component deterioration, allowing for more efficient heat transfer and operation.
Implementation Method 1
heat generated in each of the opposing electronic components can be dissipated through two paths. More specifically, the two paths include a path that allows heat to dissipate through a mount board on which one electronic component is mounted, and a path that allows heat to dissipate, by way of another electronic component in contact with the one electronic component, through a mount board on which the other electronic component is mounted
Implementation Method 2
The second major surface directly contacts the fourth and sixth major surfaces, or indirectly contacts the fourth and sixth major surfaces with a bonding layer interposed between the second major surface and the fourth and sixth major surfaces
Data Source
AI summary
An electronic component device includes first and second mount boards, and first, second, and third electronic components. The first electronic component includes a first major surface and a second major surface, and is disposed on the first mount board. The first major surface is positioned closer to the first mount board than the second major surface. The second electronic component includes a third major surface and a fourth major surface, and is disposed on the second mount board. The third major surface is positioned closer to the second mount board than the fourth major surface. The third electronic component includes a fifth major surface and a sixth major surface, and is disposed on the second mount board. The fifth major surface is positioned closer to the second mount board than the sixth major surface. The second major surface directly contacts the fourth and sixth major surfaces, or indirectly contacts the fourth and sixth major surfaces with a bonding layer interposed therebetween.