Electronic Component Buffer Electrode Impact Resistance
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Solution Overview
Problem
Existing electronic components with ceramic element bodies made of glass-based materials face limitations in impact resistance, particularly when using BAS materials like Ba, Al, and Si, requiring further improvements to withstand external shocks.
Innovation Solution
The electronic component design incorporates a ceramic element body with a base electrode layer that includes a buffer portion, comprising a first region with 15-50 vol% voids and glass, and a second region with 1-10 vol% voids and glass, applied in specific thicknesses to enhance impact resistance and prevent plating penetration, along with a manufacturing method involving conductive pastes and firing processes to form these regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ceramic element body including glass made of BAS material is used, then the electronic component achieves basic structural integrity, but the impact resistance is insufficient
Solution Approach 1:
The base electrode layer is designed with spatially varying void content: a first region with 15-50 vol% voids for impact buffering, and a second region with 1-10 vol% voids for plating penetration resistance. This local quality differentiation resolves the contradiction by assigning different functional properties to different zones of the same component.
Solution Approach 2:
The base electrode layer is formulated as a composite material containing metal particles, glass particles, and voids in specific proportions. This composite structure combines the ductility of metal, the thermal stability of glass, and the energy-absorbing capacity of voids, achieving both impact resistance and plating penetration resistance simultaneously.
2Strength
If the base electrode layer includes a high volume of buffer portion (voids and glass), then impact resistance improves, but the layer becomes too thick and compromises structural integrity
Solution Approach 1:
The base electrode layer is designed with spatially varying void content: a first region with 15-50 vol% voids for impact buffering, and a second region with 1-10 vol% voids for plating penetration resistance. This local quality differentiation resolves the contradiction by assigning different functional properties to different zones of the same component.
Solution Approach 2:
The void content parameter is optimized within specific ranges (15-50 vol% in first region, 1-10 vol% in second region) to achieve the desired balance between impact resistance and thickness control, preventing excessive layer thickening while maintaining protective functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the impact resistance of electronic components and prevents plating penetration, ensuring the components can withstand various impact directions and maintain functionality.
Implementation Method 1
a base electrode layer that is provided on the ceramic element body and includes a buffer portion to buffer an impact
Data Source
AI summary
An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.