Electronic Component Conductive Resin Plating Adhesion
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Solution Overview
Problem
Existing electronic components face challenges in maintaining the integrity of the plating layer due to thermal impacts, leading to reliability issues and loss of conductivity, particularly in miniaturized high-performance devices.
Innovation Solution
The electronic component incorporates a conductive resin layer with metal particles, a first intermetallic compound, and a base resin, along with a second intermetallic compound on the boundary between the conductive resin layer and the plating layer, enhancing adhesion strength and heat resistance through a manufacturing process involving curing and plating heat treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer is applied to the external electrode to improve reliability and absorb tensile stress, then the adhesion strength between the conductive resin layer and plating layer is improved, but the plating layer may be leached to be lost due to thermal impact from soldering heat
Solution Approach 1:
A nickel alloy layer is introduced as an intermediate layer between the conductive resin layer and the solder plating layer. This intermediary layer acts as a barrier that prevents direct thermal and chemical interaction between the solder and the conductive resin layer, thereby preventing plating layer leaching while maintaining adhesion strength.
Solution Approach 2:
The external electrode structure is designed as a composite material system consisting of multiple layers: conductive resin layer, nickel alloy layer, and solder plating layer. Each layer contributes specific properties - the conductive resin provides stress absorption and conductivity, the nickel alloy provides thermal and chemical barrier properties, and the solder layer provides electrical connectivity and solderability.
2Volume of moving object
If the electronic component is miniaturized to meet high-performance requirements, then the size is reduced, but the heat resistance and reliability are compromised due to increased thermal stress concentration
Solution Approach 1:
The nickel alloy layer is specifically designed with controlled thickness and composition parameters. By optimizing the alloy composition and layer thickness, the structure achieves optimal balance between thermal barrier performance and mechanical adhesion, enabling miniaturized components to withstand thermal stress without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the adhesion strength between the conductive resin layer and the plating layer, preventing plating layer loss during thermal events and enhancing the reliability and heat resistance of electronic components.
Implementation Method 1
a low-melting-point metal powder coated with a second organic material
Implementation Method 2
forming a first intermetallic compound between the metal particles and the low-melting-point metal
Implementation Method 3
a second intermetallic compound is disposed on a boundary between the conductive resin layer and the plating layer
Implementation Method 4
applying and drying a paste for a conductive resin layer to and on the body and then performing a curing heat treatment to form a conductive resin layer
Implementation Method 5
plating a metal material on the conductive resin layer and then performing a plating heat treatment to form a plating layer
Data Source
AI summary
An electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode including a conductive resin layer, disposed on the body, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a metal particle, a first intermetallic compound, and a base resin, and a second intermetallic compound is disposed on a boundary between the conductive resin layer and the plating layer.