Cooling system of an electric construction element that heats up
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling devices for electronic components, such as semiconductor elements, face inefficiencies in heat dissipation due to surface and contour tolerances, leading to mechanical stress and unreliable connections, especially in series production with components from different manufacturers, resulting in inadequate thermal transfer and potential mechanical failure of connection pins.
Innovation Solution
The cooling device features defined pairs of clamping surfaces that accommodate electronic components with planar contact, allowing for adjustable and reproducible clamping forces without transmitting mechanical stress to connection pins, using a clamp assembly with a clamp holder and screw connection to ensure secure attachment and effective heat dissipation, and incorporates a cooling element with a heat-dissipating foot for enhanced thermal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional clamp and screw connections are used to press the heat conducting surface against the cooling surface, then cooling effectiveness is improved, but mechanical stress is transmitted to the connection pins causing faulty or loose soldered connections
Solution Approach 1:
The clamping force application is segmented into two independent systems: (1) the component connection to the PCB via connection pins, and (2) the heat conducting surface clamping to the cooling surface via clamping elements. This segmentation allows the clamping force to be applied locally at the heat conducting surface without transmitting mechanical stress to the connection pins, thereby maintaining both cooling effectiveness and connection reliability.
Solution Approach 2:
The clamping elements act as intermediaries between the heat conducting surface and the cooling surface. These clamping elements directly engage with the heat conducting surface and press it against the cooling surface, eliminating the need to transmit force through the connection pins. The clamping elements serve as a dedicated mechanical interface for thermal contact without involving the electrical connection pathway.
2Temperature
If clamping means are attached directly to the cooling element and component to generate clamping force, then cooling effectiveness is improved, but installation space is reduced and assembly effort increases
Solution Approach 1:
The clamping elements are merged with the bearing body structure, forming an integrated assembly where the clamping elements are already positioned and configured within the bearing body. This integration eliminates the need for separate attachment operations and reduces the number of assembly steps. The clamping elements are pre-configured to engage with the heat conducting surface, simplifying the overall assembly process while maintaining effective clamping force.
Solution Approach 2:
The clamping elements are pre-positioned and pre-configured within the bearing body during manufacturing, rather than being attached during final assembly. This preliminary action ensures that the clamping force application mechanism is already in place and properly configured before the component is installed, reducing on-site assembly complexity and installation space requirements.
3Ease of manufacture
If components with surface or contour tolerances are assembled using direct clamping, then manufacturing flexibility is improved, but thermal heat transfer is impaired due to mismatches
Solution Approach 1:
The clamping elements are designed with adjustable clamping force parameters that can be optimized to compensate for surface and contour tolerances. By varying the clamping force magnitude and distribution, the system can accommodate dimensional variations in components from different manufacturers while maintaining sufficient thermal contact pressure for effective heat dissipation.
Solution Approach 2:
The clamping elements apply clamping force locally at the heat conducting surface, concentrating the pressure exactly where thermal contact is needed. This localized quality of force application ensures that even with surface tolerances, the critical thermal interface maintains adequate contact pressure, while the rest of the component can tolerate dimensional variations without affecting heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling efficiency, reduces mechanical stress on connection pins, and facilitates assembly by accommodating dimensional differences, ensuring reliable and effective heat dissipation even in environments with varying component tolerances, such as in electronically controlled water heaters.
Implementation Method 1
a heat-dissipating heat-conducting surface of the component must be pressed against a heat-dissipating cooling surface
Implementation Method 2
a clamping assembly in which at least one electronic component is pressed onto the associated cooling element with the heat-conducting surface of the component being in planar or planar contact with the cooling surface
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The device (1) has clamping device (7) having clamping surfaces (71,72) arranged facing the bearing portion (5). The cooling element (3) and electronic component (2) in the terminal network (8) are contacted with cooling surface (31), and the heat conduction portion (21) is clampingly inserted between the clamping surfaces. A printed circuit board (6) has several recesses for one-dimensional penetration of terminal network. The terminal network of recesses and the clamping surfaces are associated with the side of head, through portion of cooling element formed foot side.