Electronic Component Cutting Method for Conductor Alignment
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Solution Overview
Problem
Existing methods for manufacturing electronic components from mother blocks fail to effectively suppress positional misalignment of internal conductors, leading to reduced water resistance and electrical insulation quality due to distorted conductor positions during the cutting process.
Innovation Solution
A method involving the cutting of mother blocks into multiple blocks and then further into individual chips, where the internal conductors are positioned centrally, using image processing to ensure equal gaps and precise cutting lines, thereby minimizing positional misalignment and maintaining conductor centrality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the mother block is cut based on imaging both end faces, then the cutting process is simplified, but positional misalignment of internal conductors in center chips cannot be suppressed
Solution Approach 1:
The cutting process is divided into two distinct stages: first cutting the mother block into intermediate blocks, then cutting each intermediate block into individual chips. This segmentation allows different cutting strategies to be applied at each stage, with the second cutting stage specifically targeting center chip precision to resolve the positional misalignment issue while maintaining overall process efficiency
Solution Approach 2:
The first cutting stage performs preliminary action by creating intermediate blocks that are then processed in the second stage. This preliminary cutting establishes a structure that enables more precise control over the final chip cutting, particularly for center chips, by allowing the cutting line to be determined based on actual conductor positions in each intermediate block
2Productivity
If ceramic green sheets are pressure-bonded in the press process, then the mother block is formed, but flow of green sheets causes positional misalignment of internal conductors
Solution Approach 1:
The cutting line determination process uses feedback from imaging the actual positions of internal conductors on the end faces of intermediate blocks. This feedback mechanism allows the cutting line to be adjusted based on the actual conductor positions, compensating for misalignments that occurred during the pressure-bonding process and ensuring precise positioning in the final chips
Solution Approach 2:
The cutting strategy changes parameters between the two cutting stages: the first stage uses general cutting parameters for efficiency, while the second stage adjusts cutting parameters based on actual conductor positions, including modifying the cutting line position to account for green sheet flow and maintain precision in center chips
Data Source
AI summary
A method of manufacturing an electronic component includes the steps of: preparing a first block formed by stacking a plurality of green sheets serving as an element body; cutting the first block in a first direction into a plurality of second blocks such that a portion of an internal conductor connected to an external electrode is exposed at a cut surface; and cutting each of the plurality of second blocks in a second direction crossing the first direction such that the internal conductor exposed at each of both cut surfaces is located in the center of a portion serving as each element body in the first direction in each of the plurality of second blocks.