Electronic Component Device Thermal Expansion Buffering
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Solution Overview
Problem
Electronic component devices face issues with wiring disconnection due to thermal expansion coefficient differences between ceramic element bodies and surrounding resin structures, leading to wiring cuts at their boundaries.
Innovation Solution
Incorporating an adjustment electrode with a higher thermal expansion coefficient than the element body, strategically placed between the resin structure and the inner electrode, to reduce thermal expansion coefficient differences and prevent wiring disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic element body is embedded in a resin structure, then the electronic component achieves structural support and electrical connection, but the wiring is cut at the boundary between the resin structure and the element body due to thermal expansion coefficient differences
Solution Approach 1:
An adjustment electrode is introduced as an intermediary component between the inner electrode and the resin structure. This adjustment electrode has a thermal expansion coefficient that is higher than that of the element body, serving as a buffer to reduce the thermal expansion coefficient difference between the inner electrode and the resin structure, thereby preventing wiring cut at the boundary.
Solution Approach 2:
The thermal expansion coefficient parameter is actively managed by selecting materials with specific thermal expansion coefficients. The adjustment electrode is chosen to have a thermal expansion coefficient that satisfies the relationship: thermal expansion coefficient of resin structure ≤ thermal expansion coefficient of adjustment electrode ≤ thermal expansion coefficient of inner electrode, creating a gradual transition that reduces thermal stress.
2Ease of manufacture
If the resin structure is made with a material having a larger thermal expansion coefficient, then the resin structure is easier to manufacture and more flexible, but it expands more easily by heat causing wiring cut at the boundary
Solution Approach 1:
The adjustment electrode serves as a mediator that allows the use of resin materials with larger thermal expansion coefficients (which are easier to manufacture and more flexible) while preventing the harmful effect of excessive thermal expansion. The adjustment electrode absorbs the thermal expansion difference, enabling the resin structure to maintain its manufacturing advantages without compromising wiring connection stability.
3Stability of the object's composition
If the element body is made of ceramic material, then the element body provides excellent electrical properties and structural stability, but the difference in thermal expansion coefficient with the resin structure causes the resin structure to expand more easily by heat
Solution Approach 1:
The adjustment electrode acts as an intermediary layer between the ceramic element body and the resin structure. It compensates for the thermal expansion coefficient difference by having a thermal expansion coefficient that is higher than the ceramic but lower than or equal to the resin structure, thereby reducing the thermal stress on the wiring at the boundary while maintaining the structural stability of the ceramic element body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces or prevents wiring disconnection at the boundary between the resin structure and the element body, enhancing thermal shock resistance and reliability of electronic component devices.
Implementation Method 1
the thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy a relationship of the thermal expansion coefficient of the resin structure≤the thermal expansion coefficient of the adjustment region≤the thermal expansion coefficient of the inner electrode
Data Source
AI summary
An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure≤the thermal expansion coefficient of the adjustment region≤the thermal expansion coefficient of the inner electrode.