Electronic Component Dummy Electrode Pattern Manufacturing
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Solution Overview
Problem
Conventional thin film electronic components require expensive equipment and result in high manufacturing costs due to the need for miniaturization and thinning, which is not efficiently addressed by existing technologies.
Innovation Solution
A manufacturing method for electronic components that includes forming conductor patterns and electrode patterns on a substrate, with dummy electrode patterns of the same material, positioned to reduce manufacturing costs and enhance miniaturization and thinning, using techniques such as screen printing and thin film sputtering, and adjusting pattern widths and forming pattern grooves with lasers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If thin film electronic components are manufactured using conventional methods to achieve miniaturization and thinning, then the component size and thickness are reduced, but manufacturing costs increase due to expensive equipment requirements
Solution Approach 1:
The manufacturing process is divided into distinct stages: forming conductor patterns on the substrate, forming electrode patterns on the conductor patterns, and forming dummy electrode patterns on the substrate. This segmentation allows each stage to be optimized independently, reducing the need for expensive integrated thin film equipment while achieving the desired miniaturization and thinning.
Solution Approach 2:
The patent introduces dummy electrode patterns disposed at specific positions relative to the electrode patterns (spaced apart by a predetermined distance). This adds a spatial dimension to the design that improves electrical characteristics and allows for cost-effective manufacturing using less sophisticated equipment, as the dummy patterns can be formed using the same printing process as the electrode patterns.
2Volume of moving object
If thin film electronic components are manufactured to reduce size, then miniaturization is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The same printing process and materials are used to form both the electrode patterns and the dummy electrode patterns. This universal approach simplifies the manufacturing process by eliminating the need for separate fabrication steps and expensive specialized equipment, while still achieving miniaturization through the optimized layout and spacing of patterns.
Solution Approach 2:
The conductor patterns are formed on the substrate first, providing a foundation upon which electrode patterns and dummy electrode patterns can be subsequently formed. This preliminary action simplifies the overall manufacturing process by establishing the basic structure before adding functional elements, reducing the need for complex rework or adjustment steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces manufacturing costs while achieving miniaturization and thinning of electronic components, improving their performance and reliability by optimizing the use of materials and processes.
Implementation Method 1
forming a conductor film on the substrate on which the at least one first paste portion is formed
Data Source
AI summary
An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.