Electronic Component Dummy Patterns for Cost Reduction
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Solution Overview
Problem
Conventional thin film electronic components require expensive equipment and result in high manufacturing costs due to the need for miniaturization and thinning, which is not efficiently addressed by existing technologies.
Innovation Solution
A manufacturing method for electronic components that includes a substrate with a conductor pattern and electrode patterns, along with dummy conductor and electrode patterns, where the widths of the electrode patterns match the corresponding portions of the conductor pattern, allowing for cost reduction through the use of screen printing and sputtering techniques, and the application of organic and inorganic materials for pattern formation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional thin film electronic components are used to achieve miniaturization and thinning, then the electronic component size is reduced, but manufacturing costs increase due to expensive equipment requirements
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: forming conductor patterns on a substrate, adding electrode patterns, and incorporating dummy patterns. This segmentation allows each stage to be optimized independently, enabling the use of cost-effective techniques like screen printing for conductor patterns while achieving miniaturization through precise pattern design and controlled thickness of individual layers.
2Length of moving object
If electrode pattern widths are reduced to enable miniaturization, then component size decreases, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different materials and processing techniques to different regions: conductor patterns use screen-printed pastes with specific organic-inorganic compositions optimized for certain areas, while electrode patterns use sputtered thin films with controlled widths. Dummy patterns are strategically placed to maintain local electrical characteristics. This local optimization enables precise control of electrode pattern widths at reduced sizes while maintaining manufacturing feasibility.
Solution Approach 2:
The conductor patterns utilize composite organic-inorganic paste materials that combine the advantages of both material types: organic binders provide flexibility and adhesion, while inorganic particles provide conductivity. This composite approach allows for precise pattern formation with controlled width even at miniaturized dimensions, reducing the impact of manufacturing variability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs while enabling miniaturization and thinning of electronic components, preventing short failures during plating and improving electrical characteristics by using organic and inorganic materials effectively.
Implementation Method 1
forming an electrode film on the substrate on which the conductor film and the at least one first paste portion are formed
Data Source
AI summary
An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.