Electronic Component Outer Electrode Crack Prevention
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Solution Overview
Problem
Existing electronic components face issues with cracks caused by tensile stress due to thermal contraction of solder fillets, leading to reduced electrostatic capacity and deteriorated electric characteristics.
Innovation Solution
The electronic component design includes a sintered layer, a reinforcement layer without Sn but containing Cu or Ni, an insulation layer, and a Sn-containing layer, with specific configurations to prevent crack formation by managing the solder fillet's thermal contraction, ensuring the insulation layer covers critical areas and the Sn-containing layer extends to protect the reinforcement layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solder fillet is used to mount the electronic component, then reliable electrical connection is achieved, but tensile stress from thermal contraction causes cracks in the element assembly
Solution Approach 1:
The outer electrode is segmented into multiple functional layers: a sintered metal layer for electrical connection, a Sn-containing layer for soldering, and a crack prevention layer containing Cu or Ni. This segmentation allows each layer to perform its specific function while protecting the element assembly from tensile stress.
Solution Approach 2:
The crack prevention layer acts as an intermediary between the solder fillet and the element assembly. It absorbs and distributes the tensile stress from thermal contraction, preventing direct transmission of stress to the element assembly and avoiding crack formation.
2Ease of manufacture
If the outer electrode structure is simplified, then manufacturing is easier, but crack prevention capability is reduced
Solution Approach 1:
The outer electrode uses composite material structure combining sintered metal, Sn-containing material, and Cu or Ni materials. Each material is selected for its specific properties: sintered metal for electrical conductivity, Sn for solderability, and Cu/Ni for crack prevention. This composite structure achieves both manufacturability and crack prevention.
Solution Approach 2:
The invention changes the material composition parameters of the outer electrode by incorporating specific ratios of Sn, Cu, and Ni. By adjusting these compositional parameters, the outer electrode achieves optimal balance between solderability, electrical conductivity, and crack prevention capabilities.
3Ease of manufacture
If the Sn-containing layer covers the entire reinforcement layer, then solderability is improved, but crack prevention effectiveness is reduced
Solution Approach 1:
The Sn-containing layer is selectively applied only to specific regions of the outer electrode surface where soldering is required, rather than covering the entire reinforcement layer. This local application maintains solderability in necessary areas while preserving the crack prevention capability of the reinforcement layer in critical stress zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces or prevents crack formation, maintaining the electronic component's electric characteristics and ensuring stable mounting and reduced acoustic noise.
Implementation Method 1
tensile stress due to thermal contraction of a solder fillet
Data Source
AI summary
In a method for manufacturing an electronic component, a step of providing an outer electrode includes a step of providing a sintered layer including a sintered metal, a step of providing a reinforcement layer not containing Sn but including Cu or Ni, a step of providing an insulation layer, and a step of providing a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover Bich. The reinforcement layer covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.