Electronic Component External Electrode Structure for Crack Prevention

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Solution Overview

Problem

The existing electronic components face issues with insufficient mounting space and electrical noise, particularly due to the expansion and contraction of epoxy molding compounds during soldering, which can lead to internal cracks in inductors with large lengths, affecting their electrical characteristics and reliability.

Innovation Solution

The electronic component design features a modified structure for the external electrodes, including first and second electrode layers that cover the body's side portions, with the internal electrode connected through these layers, enhancing adhesion to the printed circuit board and maintaining volume efficiency by increasing the gap between the external electrodes and the body, thus preventing internal cracks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the inductor has a large length in longitudinal direction, then the electrical characteristics are improved, but the possibility of internal crack occurrence due to EMC contraction and expansion is increased

Engineering Contradiction:
Improveelectrical characteristicsVSAvoidresistance to internal crack
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The external electrode is divided into multiple layers (first electrode layer and second electrode layer) that are disposed at different positions and orientations. This segmentation allows each layer to independently accommodate thermal stress, preventing stress concentration that would cause internal cracks in long inductors.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-plane electrode structure to a multi-layer three-dimensional electrode configuration. The first electrode layer is disposed at a first position while the second electrode layer is disposed at a second position different from the first position, creating a layered structure that spans multiple dimensions and effectively distributes thermal stress.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the external electrode structure is modified to improve adhesion, then the interface adhesion is improved, but the device complexity increases

Engineering Contradiction:
Improveinterface adhesionVSAvoidelectrode structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The first and second electrode layers are electrically connected through the internal electrode, merging their functions into a unified electrical pathway. This combining approach improves interface adhesion through the multi-layer structure while maintaining electrical simplicity by providing a single continuous conductive path from the external electrodes through the internal electrode to the terminal.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11101065B2Electronic component
Publication Date: 2021.08.24 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11101065B2 patent drawing
  • US11101065B2 patent drawing
  • US11101065B2 patent drawing

AI summary

An electronic component includes a body having an internal electrode disposed therein, and an external electrode disposed on the body and connected to the internal electrode, wherein in a cross section of the body cut in length and thickness directions, the external electrode includes a first electrode layer disposed below the body and a second electrode layer covering at least the first electrode layer and a side portion of the body, and the internal electrode is connected to the second electrode layer through the side portion of the body.