Electronic Component Outer Electrode Fixing Structure
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Solution Overview
Problem
Existing electronic components with inductors face issues with outer electrode dislodging due to reduced attachment between outer electrode portions and the base substrate, especially when the circuit board experiences deformation from impact or temperature changes, leading to instability in mounting.
Innovation Solution
The electronic component features a multilayer body with insulator layers and outer conductor layers that include a fixing portion within a triangular region, enhancing the attachment area and reducing dislodging by using via-hole conductors to connect adjacent outer conductor layers, thereby increasing the contact area and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the outer electrode portions are formed to have a substantially L-shaped configuration to improve fixing to the circuit board, then the firm fixing is achieved through solder fillet formation, but the attachment between outer electrode portions and the base substrate decreases, leading to dislodging when circuit board deformation occurs
Solution Approach 1:
The outer conductor layers extend not only in the left-right direction but also in the up-down direction, creating a two-dimensional extension pattern. This dimensional expansion increases the contact area with the base substrate while maintaining the L-shaped configuration for solder fillet formation, thus resolving the contradiction between firm fixing and substrate attachment
Solution Approach 2:
The outer conductor layers are formed to extend in multiple directions before mounting, creating a configuration that anticipates circuit board deformation. This preliminary structural arrangement ensures that when deformation occurs, the outer electrode portions remain firmly attached to the base substrate due to their extended contact areas, preventing dislodging
2Volume of moving object
If the inductor and outer electrode portions are manufactured in smaller sizes to reduce component size, then miniaturization is achieved, but the attachment area decreases making the outer electrode portions more prone to dislodging
Solution Approach 1:
The outer conductor layers exhibit different extension patterns in different regions: in the left-right direction they extend to provide mounting surface, while in the up-down direction they extend to provide enhanced attachment area. This local quality differentiation allows miniaturization while maintaining sufficient attachment strength through strategically positioned extensions
3Strength
If the outer conductor layers extend further to increase contact area and prevent dislodging, then attachment strength improves, but the inductor coil diameter may be restricted
Solution Approach 1:
The outer conductor layers extend asymmetrically with different lengths in the left-right direction versus the up-down direction. This asymmetric extension pattern allows the inductor coil to be positioned in the region with sufficient space while the outer conductor layers extend in directions that maximize attachment strength without encroaching on the inductor coil space
Data Source
AI summary
An electronic component includes insulator layers having first and second sides respectively extending in first and second directions from a first point, and outer conductor layers extends in the first and second direction from the first point. Each of the outer conductor layers has second and third points. One of the outer conductor layers has a fixing portion inside a region having a third side connecting the second and third points, and fourth and fifth sides respectively extending from the second point in the reverse first direction and from the third point in the reverse second direction.