Electronic Component Outer Electrode Segmentation for Mounting Stability
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Solution Overview
Problem
Conventional electronic components mounted on circuit boards are prone to inclination due to insufficient solder adhesion, resulting from outer electrodes being limited to the mount surface, which reduces the solder's surface tension and attraction force.
Innovation Solution
The electronic component design includes first and second outer electrodes arranged in a predetermined direction on the mount surface, with each contact surface divided into multiple portions and formed by plating over exposed inner conductors, increasing the solder's surface area and symmetry to enhance adhesion and prevent inclination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If outer electrodes are provided only on the mount surface, then the electronic component can be mounted in a narrow region of the circuit board, but the solder does not adhere properly and the component becomes mounted with inclination
Solution Approach 1:
The contact surface of each outer electrode is divided into multiple portions (first contact surface and second contact surface) that are symmetrically arranged. This segmentation increases the solder adhesion area and distributes the mounting forces evenly, preventing inclination during mounting while maintaining compact footprint.
2Reliability
If outer electrodes are arranged symmetrically with divided contact surfaces, then solder adhesion and attraction force are enhanced, but the electrode structure becomes more complex
Solution Approach 1:
While the overall electrode structure maintains symmetry for balanced mounting, the contact surfaces are divided into asymmetric portions relative to the electrode body center. This asymmetric division within symmetric arrangement optimizes solder flow and adhesion while controlling structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively increases the solder's surface tension and attraction force, preventing the electronic component from being mounted on the circuit board with inclination by ensuring secure and even attachment.
Implementation Method 1
forming the first outer electrode and the second outer electrode by plating such that the inner conductors exposed from the mount surface are covered with the first outer electrode and the second outer electrode
Data Source
AI summary
An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the electronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.