Electronic Component Electrode Spacing for Solder Stress Relief

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Solution Overview

Problem

The shrinkage of solder during cooling applies tensile stress to outer electrodes in electronic components, leading to potential peeling and decreased reliability.

Innovation Solution

The electronic component design features a first electrode attached to the mounting surface and a second electrode attached to the exposure surface, spaced from the first electrode, which reduces tensile stress due to solder shrinkage by allowing for a gap that mitigates the stress applied during soldering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the outer electrode is electrically connected to a circuit board by using solder, then the electrical connection is achieved, but the tensile stress due to solder shrinkage causes the outer electrode to peel from the body

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidelectrode attachment strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The outer electrode is divided into multiple sections: an electrode layer directly attached to the body, and a separate protruding portion that extends outward for solder connection. This segmentation isolates the electrode layer from direct solder stress, preventing peeling while maintaining electrical connectivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protruding portion of the outer electrode acts as an intermediary element between the electrode layer and the solder. It absorbs the shrinkage stress during cooling, preventing direct transmission of tensile stress to the electrode-body interface and thus preventing peeling.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the outer electrode is made continuous from the body surface to the side surface, then the electrical connection path is ensured, but the solder shrinkage stress causes peeling at the interface

Engineering Contradiction:

Improveelectrical connection continuityVSAvoidtensile stress from solder shrinkage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The outer electrode structure is segmented into an electrode layer portion attached to the body and a protruding portion for solder attachment. This segmentation maintains electrical continuity while creating a stress-absorbing zone that prevents harmful tensile stress from reaching the body interface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protruding portion is designed to intentionally absorb the harmful shrinkage stress of solder during cooling. By converting the harmful stress into a localized effect on the protruding portion, the design protects the electrode-body interface from peeling while maintaining electrical functionality.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS20230103865A1Electronic component and coil component

Publication Date: 2023.04.06 MURATA MFG CO LTD

AI summary

An electronic component includes a body having a mounting surface which faces a mounting substrate and an exposure surface from which an extended wiring line is exposed, a first electrode attached to the mounting surface, and a second electrode which is electrically connected to the extended wiring line and which is attached to the exposure surface. The first electrode and the second electrode second electrode are spaced from each other.