Electronic Component Electrode Thermal Conductivity Management
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Solution Overview
Problem
Heat transfer from circuit boards to electronic components can lead to deterioration in their characteristics and reliability, as existing designs do not effectively manage thermal conductivity.
Innovation Solution
An electronic component with a semiconductor ceramic element body, a thin film layer for insulation, and external electrodes with varying thermal conductivity layers, where the second electrode layer has lower thermal conductivity than the first, covering the first electrode layer, and a thin film layer formed along the surface shapes to enhance adhesion and prevent heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external electrodes are disposed on end surfaces of the element body for electrical connection, then electrical connectivity is improved, but heat transfer from circuit board to element body increases, deteriorating reliability
Solution Approach 1:
The patent applies local quality by creating a multi-layer electrode structure where different layers have different thermal conductivity properties. The first electrode layer (closer to element body) has higher thermal conductivity for electrical connection, while the second electrode layer (outer layer) has lower thermal conductivity to block heat transfer. This local differentiation of thermal properties allows simultaneous achievement of electrical connectivity and heat isolation.
Solution Approach 2:
The patent uses composite materials by combining multiple electrode layers with different thermal conductivity characteristics. The external electrode comprises a first electrode layer made of conductive material with higher thermal conductivity and a second electrode layer made of conductive material with lower thermal conductivity. This composite structure enables the electrode to perform dual functions: electrical conduction and thermal insulation.
2Object-affected harmful factors
If thin film layer is formed to cover element body surfaces for heat isolation, then heat transfer is reduced, but adhesion between thin film layer and electrode layers may be insufficient
Solution Approach 1:
The patent employs a thin film layer covering the element body surfaces, which acts as a flexible thermal barrier. This thin film layer is designed to provide heat isolation while maintaining adhesion to the electrode layers through proper material selection and surface treatment, preventing separation during mounting and operation.
Solution Approach 2:
The thin film layer serves as an intermediary between the element body and the electrode layers. It provides thermal insulation while maintaining electrical connection pathways and ensuring mechanical adhesion. The thin film layer mediates between the conflicting requirements of heat isolation and bonding strength.
3Ease of manufacture
If uniform thickness thin film layer is used on all surfaces, then manufacturing is simplified, but heat isolation effectiveness is reduced due to heat transfer through thinner regions
Solution Approach 1:
The patent applies local quality by varying the thickness of the thin film layer across different surfaces of the element body. The thin film layer is formed with greater thickness on side surfaces that are more susceptible to heat transfer from the circuit board, while maintaining appropriate thickness on end surfaces. This localized thickness variation optimizes heat isolation effectiveness while managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes heat transfer from circuit boards to the electronic component, maintaining its reliability and ensuring electrical connections while preventing electrode separation, thus maintaining the component's performance and accuracy in temperature detection.
Implementation Method 1
a thin film layer disposed to cover the pair of end surfaces and the four side surfaces and having an electrical insulation property
Implementation Method 2
a thermal conductivity of the second electrode layer is lower than a thermal conductivity of the first electrode layer
Implementation Method 3
a thermal conductivity of the second electrode layer is lower than a thermal conductivity of the first electrode layer
Implementation Method 4
a surface area of the thin film layer can increase and an anchoring effect can be obtained by forming the thin film layer along the surface shape of the outer surface of the element body
Data Source
AI summary
An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.