Electronic Component Electrode Thickness Design
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Solution Overview
Problem
Existing electronic components face issues with crack occurrence and increased equivalent series resistance (ESR) due to stress concentration at the end edges of external electrodes, particularly when solder-mounted on electronic devices.
Innovation Solution
The electronic component design features a conductive resin layer with a smaller average thickness than the sintered metal layer, strategically exposing the sintered metal layer in certain regions to reduce stress concentration and maintain electrical connectivity without the conductive resin layer, thereby suppressing crack occurrence and ESR increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the conductive resin layer is increased to suppress crack occurrence, then the crack suppression effect is improved, but the equivalent series resistance (ESR) increases
Solution Approach 1:
The patent applies local quality by making the conductive resin layer thickness non-uniform: thinner at the end surface (first electrode portion) to reduce ESR, and thicker at the side surface (second electrode portion) to suppress cracks. This spatial variation in thickness allows each region to optimize for its specific function.
Solution Approach 2:
The patent transitions from a single-dimensional thickness parameter to a two-dimensional thickness distribution across different surfaces. By controlling thickness differently in the first electrode portion (end surface) and second electrode portion (side surface), the solution addresses both ESR and crack suppression simultaneously through dimensional differentiation.
2Loss of energy
If the average thickness of the conductive resin layer is made smaller than the sintered metal layer, then the ESR is reduced, but the crack suppression effect may be compromised
Solution Approach 1:
The patent ensures that while the overall average thickness of the conductive resin layer is smaller than the sintered metal layer (reducing ESR), the conductive resin layer still extends to cover the end edge of the sintered metal layer at the side surface (providing crack suppression). This local extension at critical stress points maintains reliability without sacrificing energy efficiency.
Data Source
AI summary
An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer and a conductive resin layer. The conductive resin layer is formed over the sintered metal layer and the element body. An average thickness of the conductive resin layer is smaller than that of the sintered metal layer.