Electronic Component Evaluation via Non-Contact Optical Reference Plane
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Solution Overview
Problem
Conventional methods for evaluating electronic components before mounting on a substrate often require direct contact, leading to inaccurate measurements due to inclination issues and increased inspection load, resulting in potential contact failures and inefficient sampling inspections.
Innovation Solution
An electronic component evaluation method and device that uses a 3D camera to create a reference plane based on mounting terminal positions, allowing for non-contact inspection of height information and inclination detection without direct contact, enabling precise evaluation of component shapes and configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a height gauge is used to measure the inclination of the electronic component, then the height can be measured with high accuracy, but the measurement becomes inaccurate when the component is already inclined or changes state during measurement
Solution Approach 1:
The patent replaces the mechanical height gauge measurement system with a non-contact optical measurement system using a camera. The camera captures images of the electronic component from multiple angles, and the inclination is calculated based on the positional relationships of mounting terminals and component features in the images, eliminating mechanical contact and associated measurement errors.
Solution Approach 2:
The patent creates a virtual model (copy) of the electronic component based on image data captured by the camera. By constructing a three-dimensional representation from multiple two-dimensional images, the system can accurately determine inclination without physically contacting the component, thus avoiding distortion of the original object.
2Measurement precision
If direct contact measurement is performed on electronic components, then height information can be obtained, but the inspection load increases and sampling inspection becomes necessary
Solution Approach 1:
The patent replaces mechanical contact-based height measurement with non-contact optical imaging using a camera. This allows for rapid capture of component images without physical interaction, enabling inspection of all components rather than sampling, thereby increasing productivity while maintaining measurement capability.
Solution Approach 2:
The patent transitions from one-dimensional height measurement to two-dimensional image capture, which contains rich information about the component's geometry, position, and inclination. By analyzing the two-dimensional image data, the system can derive three-dimensional characteristics without requiring physical measurement tools, thus speeding up the inspection process.
3Measurement precision
If the electronic component is measured in one state but suctioned or chucked in another state, then the height measurement may not reflect the actual mounting condition
Solution Approach 1:
The patent uses non-contact optical measurement that does not apply any force to the electronic component. Since the camera-based system requires no physical contact, the component remains in its natural state during measurement, ensuring that the measured inclination accurately reflects the actual mounting condition without state changes.
4Measurement precision
If conventional contact-based inspection methods are used, then height data can be obtained, but contact failures may occur due to inclination issues during mounting
Solution Approach 1:
The patent replaces contact-based measurement with non-contact optical imaging to accurately determine component inclination before mounting. By calculating the angle between the component's upper surface and the horizontal plane using image analysis, the system can identify components with excessive inclination that would cause contact failures, allowing for preventive sorting or adjustment.
Data Source
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AI summary
An electronic component evaluation method is provided for evaluating an electronic component. The electronic component has a lower surface facing a mounting substrate, an upper surface having a flat main surface, and a plurality of mounting terminals configured to be mounted on the mounting substrate. The method includes the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals in response to the terminal position information; and detecting a height of at least one of the upper surface or the lower surface relative to the reference plane.