Electronic Component with Exposed Electrode Corners for Mount Space Reduction
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Solution Overview
Problem
Existing electronic components, such as multi-layer ceramic capacitors, face challenges in reducing mount space on circuit substrates while maintaining sufficient joint strength, as current technologies compromise joint strength for space reduction.
Innovation Solution
The electronic component design includes a chip with external electrodes, a covering portion, and exposed portions, where the external electrodes are partially covered and exposed to create a configuration that suppresses solder wet-up and spread, allowing for reduced mount space while ensuring high joint strength through increased surface area at corners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the covering portion covers the entire chip surface, then solder wet spread is suppressed and mount space is reduced, but the joint area between solder and external electrodes is reduced and joint strength is lowered
Solution Approach 1:
The covering portion is designed to cover only specific regions of the chip surface (the regions other than the corners), while leaving the corner regions exposed. This local differentiation allows the covering portion to suppress solder wet spread in most areas while preserving sufficient joint area at the corners where the external electrodes are located, thereby resolving the contradiction between reducing mount space and maintaining joint strength.
2Strength
If the external electrodes are fully exposed, then joint area and joint strength are improved, but solder wet spread increases and mount space increases
Solution Approach 1:
The design selectively exposes only the corner regions where the external electrodes are located, while covering the remaining chip surface with the covering portion. This local exposure strategy ensures sufficient joint area for strong solder joints at the electrode locations while the covered regions prevent excessive solder wet spread, thus achieving both strong joints and reduced mount space.
Solution Approach 2:
The chip surface is segmented into two functional zones: exposed corner regions for solder joint formation and covered regions for solder wet spread suppression. This segmentation allows each zone to perform its specific function optimally, with the external electrodes in the exposed corners providing adequate joint area while the covering portion in other regions limits solder spread.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the mount space for electronic components on circuit substrates while maintaining high joint strength and reliability, enabling miniaturization and high integration of electronic devices.
Implementation Method 1
wet-up of the solder at the first external electrode and the second external electrode is blocked by the covering portion
Data Source
AI summary
An electronic component includes: a chip having first and second end surfaces oriented in a direction of a first axis, first and second main surfaces oriented in a direction of a second axis orthogonal to the first axis, first and second side surfaces oriented in a direction of a third axis orthogonal to the first and second axes, and first and second external electrodes respectively covering the first and second end surfaces and each extending to the first and second main surfaces and side surfaces; a covering portion covering the chip from the first main surface toward the second main surface; and exposed portions provided to the second main surface, including regions where the first and second external electrodes are exposed without being covered with the covering portion, and being pushed out toward the first main surface along ridges connecting the first and second end surfaces and side surfaces.