Electronic Component Non-Uniform Exposure Portions Solder Adhesion
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Solution Overview
Problem
Conventional electronic components with meshlike mold patterns on outer electrodes require additional processing steps, increasing manufacturing costs and complexity.
Innovation Solution
The electronic component features a stack of insulating layers with non-uniform thicknesses and exposure portions for inner conductors, allowing for irregular surface patterns on outer electrodes formed through plating, which enhances solder adhesion without the need for a meshlike mold transfer, thereby reducing manufacturing steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a meshlike mold pattern is transferred to outer electrodes, then solder adhesion is improved, but manufacturing complexity and cost increase due to additional processing steps
Solution Approach 1:
The patent applies preliminary action by forming protrusions and recesses directly on the outer electrode surface through the stacking structure of insulating layers with varying thicknesses, before the soldering process. This eliminates the need for subsequent meshlike mold pattern transfer, reducing manufacturing steps while maintaining enhanced solder adhesion through the pre-formed surface irregularities
Solution Approach 2:
The patent extracts the meshlike mold pattern transfer process from the manufacturing sequence, replacing it with a simpler approach where surface irregularities are inherently formed during the stacking and plating process. This removes the complex additional processing step while achieving the same solder adhesion enhancement through direct formation of surface protrusions and recesses
2Strength
If a meshlike mold pattern is transferred to outer electrodes, then solder adhesion is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by forming protrusions and recesses directly on the outer electrode surface through the stacking structure of insulating layers with varying thicknesses, before the soldering process. This eliminates the need for subsequent meshlike mold pattern transfer, reducing manufacturing steps while maintaining enhanced solder adhesion through the pre-formed surface irregularities
Solution Approach 2:
The patent employs a simpler, more cost-effective approach by using varying thicknesses of insulating layers that are already part of the component structure, rather than requiring expensive meshlike mold patterns. The protrusions and recesses are formed as inherent features of the stacking process, eliminating the need for additional costly processing steps
3Ease of manufacture
If outer electrodes have uniform thickness and uniform intervals, then manufacturing is simpler, but solder contact area is reduced
Solution Approach 1:
The patent applies asymmetry by intentionally designing insulating layers with non-uniform thicknesses and non-uniform intervals between exposure portions. This creates asymmetric protrusions and recesses on the outer electrode surface, increasing the effective solder contact area compared to uniform structures, while the asymmetry itself becomes the manufacturing feature rather than a deviation
4Manufacturing precision
If exposure portions are uniformly arranged, then manufacturing precision is easier to control, but solder adhesion is reduced
Solution Approach 1:
The patent applies asymmetry by intentionally designing insulating layers with non-uniform thicknesses and non-uniform intervals between exposure portions. This creates asymmetric protrusions and recesses on the outer electrode surface, increasing the effective solder contact area compared to uniform structures, while the asymmetry itself becomes the manufacturing feature rather than a deviation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents shifting during mounting by increasing solder contact area and reduces manufacturing complexity and costs by eliminating the need for additional processing steps.
Implementation Method 1
an outer electrode on the surface covering the exposure portions
Data Source
AI summary
An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.