Electronic Component Cooling With Flexible Fluid-Channel Films
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Solution Overview
Problem
Existing cooling systems for electronic components are complex and require complex structures to prevent liquid cooling mediums from contacting the components, necessitating additional components that can interfere with heat transfer.
Innovation Solution
A cooling and/or temperature-control element utilizing a single-layer or multi-layer film that forms part of the fluid channel, allowing direct contact with the electronic component or assembly, and optionally connected to a metal layer for enhanced mechanical protection and flexibility, with regions of varying heat flux densities to optimize heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional liquid cooling systems are used with separate cooling chambers and seals, then liquid cooling medium can be contained, but the structure becomes complex and heat transfer is interfered with
Solution Approach 1:
The patent uses a flexible film instead of rigid cooling chambers and seals. The film is laid directly on the electronic component's surface, forming a conformal cooling structure that eliminates the need for separate cooling chambers, seals, and complex assembly mechanisms while maintaining liquid containment.
Solution Approach 2:
The cooling function is merged directly with the component surface by laying the film on the component. This integration eliminates the separation between the component and cooling structure, removing intermediate seals and complex mounting mechanisms, thereby simplifying the overall system structure.
2Reliability
If complex cooling structures with seals and mounting components are used, then liquid containment is achieved, but heat transfer efficiency is reduced
Solution Approach 1:
The flexible film provides direct thermal contact with the electronic component surface, eliminating thermal resistance introduced by seals, mounting brackets, and air gaps in traditional systems. The film's flexibility ensures conformal contact that maintains optimal thermal coupling.
Solution Approach 2:
The patent extracts and removes the intermediate sealing components and mounting structures from the cooling system. By eliminating these elements, the direct thermal path from the component to the cooling medium is preserved, maximizing heat transfer efficiency.
3Stability of the object's composition
If rigid cooling structures are used, then structural stability is maintained, but adaptability to different component heights is reduced
Solution Approach 1:
The flexible film can conform to various component height profiles and surface geometries, providing adaptability to different electronic components. Despite this flexibility, the film maintains structural integrity and stability when installed, achieving both adaptability and stability simultaneously.
Solution Approach 2:
The cooling structure transitions from a rigid, fixed geometry to a dynamic, adaptable form that can adjust to different component heights. The flexible film's ability to deform and conform to various surfaces provides the necessary adaptability while maintaining functional stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film-based cooling system simplifies structure, enhances heat transfer, reduces weight, and adapts to different component heights, ensuring uniform surface temperatures and improved heat extraction.
Implementation Method 1
the film is in contact with the electronic component or the electronic assembly
Implementation Method 2
at least one fluid channel for a cooling and/or temperature-control medium
Data Source
AI summary
A device comprising at least one electronic component or at least one electronic assembly, and at least one cooling and/or temperature-control element for the cooling and/or temperature control of the electronic component or of the electronic assembly, wherein the cooling and/or temperature-control element has at least one fluid channel for a cooling and/or temperature-control medium, and wherein the cooling and/or temperature-control element has at least one single-or multi-layer film, which forms at least part of the fluid channel and is in contact with the electronic component or the electronic assembly.