Electronic Component Gap Control via Housing Protrusions
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Solution Overview
Problem
Conventional electronic components face challenges in maintaining precise gaps between conductive plates and shield plates as they miniaturize, leading to difficulties in achieving desired performance, reliability, and durability.
Innovation Solution
The electronic component design incorporates a housing with a flat plate member and conductive terminals, where the gap between the external conductive member and the conductive terminal is defined by protrusions or insulators, ensuring consistent dimensions and preventing short circuits, even when miniaturized.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing is miniaturized to reduce component size, then the electronic component becomes smaller and more suitable for miniaturized devices, but the gap between adjacent conductive plates and between shield plate and conductive plate becomes difficult to maintain at predetermined dimensions
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the conductive plates and the housing inner wall. This resin layer has a predetermined thickness that defines the gap dimension, serving as a mediator that maintains the required spacing even when the housing is miniaturized. The resin layer compensates for dimensional variations in the housing, ensuring consistent gap dimensions regardless of the overall component size reduction.
2Ease of manufacture
If the housing is formed by solidifying resin to fix the conductive plates, then the housing can be easily manufactured and assembled, but it becomes difficult to strictly maintain the gap between adjacent conductive plates to a predetermined size
Solution Approach 1:
The resin layer is applied to the inner wall of the housing before the conductive plates are positioned and fixed. By performing this coating action in advance, the gap dimension is predetermined and established before assembly, making it easier to control the final gap dimensions. The resin layer acts as a pre-formed spacer that guides the positioning of conductive plates, ensuring consistent gaps without requiring high-precision machining of the housing.
3Volume of moving object
If the gap between conductive plates is reduced to maintain predetermined dimensions in miniaturized components, then the component fits better in small devices, but parasitic capacitance increases and short circuit risks increase
Solution Approach 1:
The resin layer serves as an insulating intermediary between adjacent conductive plates, maintaining an effective electrical isolation even when the physical gap is small. This resin layer prevents direct electrical contact and reduces parasitic capacitance by providing a high-resistance barrier, allowing the component to be miniaturized without compromising electrical performance or increasing short circuit risks.
Data Source
AI summary
An electronic component is provided with a housing, a conductive terminal loaded on the housing, and an external conductive member loaded on the housing. A gap between the external conductive member and the conductive terminal is defined by a protrusion formed on the housing or the external conductive member.