Electronic Component Gap Adjustment Coupling Coefficient
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Solution Overview
Problem
The existing transformer configurations, such as those disclosed in Japanese Unexamined Patent Application Publication No. 2001-307933, face challenges in finely adjusting the coupling coefficient between primary and secondary coils without increasing the height of the transformer body.
Innovation Solution
The electronic component design includes a body with insulating layers and coils where a gap is introduced within the primary coil, rather than between the coils, allowing for fine adjustment of the coupling coefficient while maintaining the body's height, by varying the position and size of the gap within the lamination direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a gap is introduced between the first coil and the second coil to adjust the coupling coefficient, then the coupling coefficient can be adjusted, but the height of the body increases
Solution Approach 1:
The patent transitions from adjusting coupling coefficient by changing the vertical distance between coils (vertical dimension) to introducing gaps within the coil windings themselves (internal structure dimension). This allows coupling coefficient adjustment without increasing the overall body height, as the gaps are incorporated within the existing coil structure rather than adding external spacing.
Solution Approach 2:
The patent segments the continuous coil structure by introducing gaps at specific locations within the first or second coils. Instead of treating the coils as continuous windings, the gaps divide the coil into sections, allowing precise control over magnetic flux distribution and coupling coefficient while maintaining compact overall dimensions.
2Manufacturing precision
If the number of prepreg sheets is increased to adjust the coupling coefficient, then the coupling coefficient can be adjusted, but the adjustment granularity is insufficient
Solution Approach 1:
The patent changes the approach from discrete parameter adjustment (number of prepreg sheets) to continuous parameter adjustment (gap size and position within coils). By varying the gap dimensions and locations within the coil structure, fine-grained control over the coupling coefficient is achieved, providing much finer adjustment granularity compared to discrete sheet additions.
3Manufacturing precision
If gaps are introduced within the coil structure, then the coupling coefficient can be finely adjusted without increasing body height, but the inductance values of the coils may change
Solution Approach 1:
The patent applies local quality by introducing gaps at specific locations within the coil structure rather than uniformly throughout. By strategically positioning gaps in regions that minimally affect overall inductance while maximizing coupling adjustment effectiveness, the patent achieves fine coupling coefficient control with minimal impact on coil inductance values, thereby maintaining circuit reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise adjustment of the coupling coefficient without significantly altering the inductance values of the coils, allowing for enhanced magnetic coupling while preventing an increase in the transformer's height.
Implementation Method 1
a first coil and a second coil inside of the body and separated by an interval between the first coil and the second coil in a lamination direction in which the insulating layers are laminated, and connected in series to each other... magnetically coupled to each other
Data Source
AI summary
An electronic component includes a body including insulating layers laminated in a Z-axis direction, and a primary coil and a secondary coil inside the body. The secondary coil includes wiring patterns separated by intervals in the Z-axis direction. The primary coil includes wiring patterns separated by intervals in the Z-axis direction, and a gap in a region sandwiched by adjacent wiring patterns. A dimension of the gap is larger than a distance between the adjacent wiring patterns that do not include the gap.