Electronic Component Ground Shield Reduces Stray Capacitance
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Solution Overview
Problem
Electronic components with multiple functional element portions often experience large stray capacitance, leading to degradation of characteristics such as filter characteristics.
Innovation Solution
The electronic component includes first and second element substrates with functional electrodes, a support layer defining a hollow space, and a conductive layer connected to ground potential, which opposes the functional electrodes and overlaps with them in a plan view, reducing stray capacitance and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple functional element portions are arranged in a compact electronic component, then the device integration is improved, but stray capacitance between functional elements increases
Solution Approach 1:
A ground conductive layer is introduced as an intermediary between the first and second functional element portions. This ground layer acts as a shield that electrically connects to the reference potential, thereby reducing the stray capacitance between the stacked functional elements while maintaining their compact arrangement.
Solution Approach 2:
The harmful electromagnetic field and stray capacitance between functional elements are extracted and redirected to the ground potential through the ground conductive layer. By providing a dedicated ground path, the parasitic effects are separated from the functional signal paths, allowing compact stacking without performance degradation.
2Volume of moving object
If functional element portions are stacked closely together, then the component size is reduced, but heat dissipation becomes difficult
Solution Approach 1:
The ground conductive layer serves multiple functions simultaneously: it acts as an electromagnetic shield to reduce stray capacitance, provides a heat dissipation path for thermal management, and maintains electrical reference potential. This multi-functional approach enables compact stacking while addressing both electrical and thermal challenges.
Solution Approach 2:
The ground conductive layer acts as a thermal intermediary between the stacked functional elements and the external environment. By providing thermal conduction paths through the ground layer, heat generated in the compact stacked configuration can be efficiently dissipated despite the reduced component volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces stray capacitance and prevents degradation of characteristics, while enhancing heat dissipation, thereby improving the performance of the electronic component.
Implementation Method 1
a first conductive layer that is provided on a second main surface and that is connected to ground potential. The first conductive layer opposes the first functional electrode in the first hollow space. The first conductive layer is overlapped with at least a portion of the first and second functional electrodes in a plan view
Implementation Method 2
The electronic component may further include a second conductive layer that is provided on a main surface of the first element substrate, which is opposite to the first functional electrode. In this case, heat dissipation of the electronic component is further improved.
Data Source
AI summary
An electronic component includes first and second element substrates, first and second functional element portions, and a support layer that defines a first hollow space over a first functional electrode with the first and second element substrates. A second functional electrode is located on a first main surface of the second element substrate. The electronic component further includes a first conductive layer that is provided on a second main surface of the second element substrate and that is connected to ground potential. The first conductive layer opposes the first functional electrode in the first hollow space. The first conductive layer is overlapped with at least a portion of the first and second functional electrodes in a plan view.