Electronic component handling apparatus and electronic component testing apparatus
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Solution Overview
Problem
Ceramic heaters used in electronic component testing apparatuses have a large heat capacity, leading to slow temperature rise rates and reduced responsiveness, as well as the risk of damage due to local thermal expansion.
Innovation Solution
The use of a flat heater with first and second heat transfer materials disposed on its surfaces, which preferentially diffuse heat and are designed to reduce the heat capacity of the heater unit, thereby improving heating rate and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a ceramic heater is used, then the heater can be manufactured with standard processes, but the heat capacity is large causing slow temperature rise rate and reduced responsiveness
Solution Approach 1:
The patent changes the material parameters of the heater from ceramic to a composite structure consisting of a flexible substrate with heating elements, thermal conductive adhesive layers, and heat dissipation plates. This parameter change reduces the heat capacity while maintaining heating effectiveness, thereby improving the temperature rise rate and responsiveness.
Solution Approach 2:
The patent employs a composite heater structure combining multiple materials: flexible substrate (e.g., polyimide), thermal conductive adhesive (e.g., epoxy resin with aluminum oxide powder), and heat dissipation plates (aluminum or copper). This composite design reduces overall heat capacity compared to solid ceramic while enabling efficient heat transfer and dissipation.
2Power
If a ceramic heater generates heat rapidly, then the heating efficiency is high, but local thermal expansion distorts the ceramic and damages the heater
Solution Approach 1:
The patent introduces heat dissipation plates at specific locations where high heat generation occurs. These plates locally enhance heat dissipation capability, preventing excessive temperature concentration and thermal distortion in critical areas, thereby maintaining heater reliability under high power operation.
Solution Approach 2:
The patent uses thermal conductive adhesive layers as intermediaries between the heating elements and the heat dissipation plates. This intermediary material facilitates efficient heat transfer from the heating elements to the dissipation plates, preventing heat accumulation and thermal stress that would otherwise damage the heater structure.
3Reliability
If a ceramic heater is used, then the heating function is reliable, but the weight and cost of the system increase
Solution Approach 1:
The patent replaces rigid ceramic with thin flexible substrate materials (e.g., polyimide films) that serve as the heater base. This dramatically reduces the weight and thickness of the heating component while maintaining its functional reliability through the composite structure and controlled thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the responsiveness of the temperature control system and prevents damage to the heater by efficiently dissipating heat, while also reducing the weight and cost of the system.
Implementation Method 1
the first and second heat transfer material may preferentially diffuse heat from the flat heater in a first direction parallel to the first and second main surfaces of the flat heater
Implementation Method 2
the heater unit comprises: a flat heater
Data Source
AI summary
An electronic component handling apparatus that handles a DUT or a carrier accommodating the DUT, including: a pressing device that: electrically connects the DUT to a socket by pressing the DUT or the carrier toward the socket, and includes: a temperature control device that: controls a temperature of the DUT, and includes: a heater unit that is a heat source, the heater unit including: a flat heater; a first heat transfer material disposed on a first main surface of the flat heater; and a second heat transfer material disposed on a second main surface of the flat heater.