Electronic Component with 3D Helical Inductor
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Solution Overview
Problem
Existing electronic components, such as filters, require a large mounting area due to the arrangement of capacitors and inductors on the substrate, which limits their compactness and efficiency.
Innovation Solution
The electronic component design features a substrate with a multilayer body and helical inductors, where capacitors and inductors are strategically positioned to reduce the mounting area and minimize overlap, allowing for a more compact configuration and reduced parasitic inductance and resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If capacitors and inductors are arranged on the main surface of the substrate, then the filter can be formed with surface mounted electronic components, but the mounting area becomes large
Solution Approach 1:
The patent transitions from two-dimensional arrangement of all components on the substrate surface to a three-dimensional configuration where the multilayer body (inductor) extends vertically. The surface mounted electronic component is positioned on the fourth main surface of the multilayer body, utilizing the vertical dimension to reduce the horizontal mounting area on the substrate.
Solution Approach 2:
The surface mounted electronic component is mounted on the fourth main surface of the multilayer body, which itself is positioned on the substrate. This nested arrangement allows the component to be housed within the vertical space occupied by the multilayer body, effectively reducing the overall footprint on the substrate surface.
2Area of stationary object
If the first surface mounted electronic component overlaps the center of the first inductor, then the mounting area is minimized, but parasitic inductance and resistance increase
Solution Approach 1:
The patent specifies that the first surface mounted electronic component should not overlap the center of the first inductor when viewed from the normal direction. This local quality constraint prevents the component from being positioned in the high-field region at the center of the inductor, thereby reducing parasitic inductance and resistance while still achieving compact mounting by allowing overlap at the peripheral regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a reduced mounting area, improved bandpass characteristics, and effective noise reduction by minimizing parasitic inductance and resistance, while maintaining desired resonant frequencies and Q values of the inductors.
Implementation Method 1
a first inductor which is provided at the multilayer body, which has substantially a helical shape circulating in a first predetermined direction when viewed from the normal direction
Data Source
AI summary
An electronic component includes a first outer electrode, a second outer electrode, a third outer electrode, and a fourth outer electrode which are provided to correspond to four corners of a second main surface; a fifth outer electrode which is provided on the second main surface; a multilayer body; a first inductor which includes a first end portion and a second end portion; and a first surface mounted electronic component which is mounted on the multilayer body and which includes a sixth outer electrode and a seventh outer electrode. The first end portion is electrically connected to the first outer electrode. The second end portion is electrically connected to the second outer electrode and the sixth outer electrode. The seventh outer electrode is electrically connected to the fifth outer electrode.