Electronic Component Homogeneous Contacting Members for Flip-Chip Reliability
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Solution Overview
Problem
In flip-chip mounting of electronic components, the bonding performance between chip bumps and circuit board pads is unstable due to varying wiring patterns, leading to potential disconnection and failure of the electronic component.
Innovation Solution
The electronic component design includes a base material with a first and second layer, where the contacting members on the second layer, corresponding to each pad, are made of the same material to ensure consistent mechanical behavior and stable bonding performance across multiple bonding parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different wiring patterns are used on the circuit board, then the circuit design flexibility is improved, but the bonding performance stability deteriorates
Solution Approach 1:
The patent applies local quality by making the contacting members in the second layer have uniform material composition specifically at the bonding locations, while other parts of the circuit board can maintain design flexibility. This localized uniformity ensures consistent bonding performance without restricting overall circuit design freedom.
Solution Approach 2:
The patent implements homogeneity by ensuring that contacting members corresponding to different pads are made of the same material in the second layer. This homogeneous material composition eliminates variations in mechanical behavior and bonding characteristics, thereby stabilizing bonding performance across different wiring patterns.
2Manufacturing precision
If varied contacting member materials are used corresponding to different pads, then the bonding optimization for specific pads is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent simplifies manufacturing by using the same material for all contacting members in the second layer, eliminating the need for multiple material deposition processes, material selection, and quality control procedures that would be required if different materials were used for different pads.
3Manufacturing precision
If different materials are used for contacting members, then the tailored bonding performance for specific pads is improved, but the consistency across bonding parts deteriorates
Solution Approach 1:
The patent ensures consistency across all bonding parts by using homogeneous material composition for contacting members. This uniformity guarantees that all pads exhibit similar mechanical behavior and bonding characteristics, eliminating variability that would arise from using different materials.
Data Source
AI summary
To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.