Electronic Component Insulating Film Edge Coverage
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Solution Overview
Problem
Electronic components are prone to cracking due to external forces acting on them during soldering, which concentrate stress at the edges of external electrodes, leading to potential cracks in the element body.
Innovation Solution
An electronic component design featuring an insulating film that continuously covers the end edges of external electrodes, preventing stress concentration and crack formation by acting as a solder resist, thereby reducing the likelihood of cracks in the element body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external electrode is directly exposed without insulating film coverage, then the soldering process is simplified and manufacturing cost is reduced, but stress concentrates at the electrode edges causing cracks in the element body
Solution Approach 1:
The insulating film is applied selectively only at the end edges of the external electrode where stress concentration occurs during soldering. This localized application prevents cracks at the critical stress points while avoiding unnecessary complexity in other areas, thus improving crack resistance without significantly increasing device complexity.
Solution Approach 2:
The insulating film is pre-applied to the end edges of the external electrode before the soldering process. This preliminary protective action prevents stress concentration and crack formation at the electrode edges during subsequent soldering operations, thereby improving reliability before the harmful stress occurs.
2Reliability
If the insulating film covers the entire external electrode surface, then crack prevention is maximized, but the soldering process becomes more complex and mounting strength may be compromised
Solution Approach 1:
Instead of applying insulating film to the entire external electrode surface, the film is applied only to the specific end edges where stress concentration occurs. This localized approach maintains crack resistance while preserving solderability in other areas, simplifying the overall manufacturing process.
Solution Approach 2:
The insulating film coverage is applied partially rather than completely - specifically at the end edges where it is most needed for crack prevention. This partial action achieves sufficient crack resistance without the excessive complexity and potential soldering issues that would result from complete surface coverage.
3Reliability
If the insulating film extends along the end edge of the external electrode, then stress concentration is prevented and crack occurrence is suppressed, but the film size increases and manufacturing cost rises
Solution Approach 1:
The insulating film is applied locally only at the end edges of the external electrode where stress concentration and crack initiation occur. This targeted application prevents cracks while minimizing the total amount of insulating film material used, avoiding unnecessary increase in manufacturing cost.
Solution Approach 2:
The insulating film coverage is applied partially - specifically at the critical end edge regions - rather than extending over the entire electrode surface. This partial coverage achieves sufficient crack prevention while controlling the quantity of film material and associated manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insulating film effectively suppresses crack occurrence in the element body by preventing stress concentration at the electrode edges, enhancing the component's reliability and reducing costs by optimizing film size and mounting strength.
Implementation Method 1
the insulating film functions as a solder resist. Since the insulating film continuously covers the end edge of the first electrode part and at least the part of the end edge of the second electrode part, a solder fillet does not reach the end edge of the first electrode part located on the first principal surface
Data Source
AI summary
An electronic component includes an element body of a rectangular parallelepiped shape, an external electrode, and an insulating film. The element body includes a first principal surface as a mounting surface, and a first side surface adjacent to the first principal surface. The external electrode includes a first electrode part and a second electrode part. The first electrode part is disposed on the first principal surface. The second electrode part is disposed on the first side surface and connected to the first electrode part. The insulating film continuously covers an end edge of the first electrode part and at least a part of an end edge of the second electrode part.