Electronic Component Insulating Part Integration

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Solution Overview

Problem

Conventional electronic components require an insulating part between the cooling member and the heat-dissipating surface, which reduces manufacturing efficiency.

Innovation Solution

An electronic component design that eliminates the need for an insulating part between the cooling member and the heat-dissipating surface by using an insulating part between the connecting body and the heat dissipating block, allowing direct contact of the cooling member with the heat-dissipating block, while maintaining electrical insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an insulating part is provided between the cooling member and the heat-dissipating surface, then electrical insulation is ensured, but manufacturing efficiency is reduced

Engineering Contradiction:
Improveelectrical insulationVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges the insulating part with the sealing part by forming the insulating part from the same resin material as the sealing part. This integration eliminates the need for separate insulating components while maintaining electrical insulation between the connecting body and heat dissipating block, thereby improving manufacturing efficiency without compromising reliability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sealing part is given multiple functions: it seals the electronic element and connecting body, and simultaneously serves as an insulating part between the connecting body and heat dissipating block. This multi-functionality reduces the total number of components and simplifies manufacturing while ensuring both sealing and electrical insulation requirements are met

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple separate parts are used for sealing and insulation, then functional requirements are met, but device complexity increases

Engineering Contradiction:
Improvesealing and insulation functionalityVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the sealing part and insulating part into a single integrated component made from the same resin material. This merging reduces the number of separate parts while maintaining both sealing and insulation functions, thereby decreasing device complexity without sacrificing functional reliability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sealing part is designed to perform multiple functions simultaneously: mechanical sealing of the electronic component and electrical insulation between conductive parts. This multi-functional design eliminates the need for separate insulating components, reducing overall device complexity while meeting all functional requirements

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances manufacturing efficiency by eliminating the need for additional insulating materials and allows for direct heat dissipation, increasing design flexibility and heat dissipation efficiency.

Implementation Method 1

an insulating part provided between the connecting body and the heat dissipating block

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

a heat dissipating block provided on one side of the connecting body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11201101B2Electronic component
Publication Date: 2021.12.14 SHINDENGEN ELECTRIC MANUFACTURING CO LTD
  • US11201101B2 patent drawing
  • US11201101B2 patent drawing
  • US11201101B2 patent drawing

AI summary

An electronic component has a base 10; an electronic element 20 provided on one side of the base 10; a connecting body 30 provided on one side of the electronic element 20; a heat dissipating block 40 provided on one side of the connecting body 30; an insulating part 50 provided between the connecting body 30 and the heat dissipating block 40; and a sealing part 90 in which the electronic element 20, the connecting body 30 and the insulating part 50 are sealed. At least a part of a surface on another side of the base 10 is exposed from the sealing part 90. At least a part of a surface on one side of the heat dissipating block 40 is exposed from the sealing part 90.