Electronic Component Marking With Shallow Laser-Etched Indicator Recesses
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Solution Overview
Problem
Existing electronic components face challenges in accurately reading information from indicator areas due to the need for deep laser engraving, which is difficult and inefficient.
Innovation Solution
Forming a recess in the indicator area with a predetermined depth shallower than D90 of the metal or sintered particles, using laser irradiation, allows for easier and more accurate information reading with reduced laser output and time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If deep laser engraving is performed on the indicator area, then information reading accuracy is improved, but laser output and processing time increase significantly
Solution Approach 1:
The patent changes the depth parameter of the recess from conventional deep engraving to a shallow depth (0.01-0.06mm), and combines it with specific laser parameters (wavelength 400-700nm, output 0.01-10W, scanning speed 1-100mm/s) to achieve accurate information marking with reduced energy consumption
Solution Approach 2:
Instead of deeply engraving the entire indicator area, the patent applies laser irradiation selectively to form recesses only in specific patterns corresponding to information to be marked, achieving partial action that reduces overall energy consumption while maintaining reading accuracy
2Measurement precision
If deep laser engraving is performed on the indicator area, then information reading accuracy is improved, but processing time increases
Solution Approach 1:
The patent optimizes laser processing parameters including reducing irradiation time to 0.01-10 seconds by using shallow recess depth (0.01-0.06mm) combined with appropriate laser output (0.01-10W) and scanning speed (1-100mm/s), achieving fast processing without sacrificing reading accuracy
Solution Approach 2:
The laser is applied only to specific areas forming information patterns rather than deeply engraving the entire indicator area, reducing total processing time while maintaining sufficient depth for accurate optical reading
3Loss of information
If elaborate indication patterns are formed on small electronic components, then information encoding capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces complex mechanical engraving processes with laser irradiation, allowing elaborate information patterns (barcodes, 2D codes, characters) to be formed directly on small component surfaces through optical energy, simplifying manufacturing while enhancing information encoding capability
Solution Approach 2:
By controlling laser parameters (wavelength, output, scanning speed, irradiation time) and recess depth (0.01-0.06mm), the patent enables precise formation of complex information patterns on small components without requiring complex manufacturing equipment or multi-step processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves information reading accuracy and enables the formation of elaborate indication patterns on small electronic components with reduced laser energy and time.
Implementation Method 1
The recess is formed by, for example, laser irradiation
Data Source
AI summary
An element body 4 includes a metal particle dispersion element 15 in which metal particles 12 are dispersed. A surface of the metal particle dispersion element 15 includes an indicator area 10. The indicator area 10 includes a recess 10a having a predetermined depth measured from a reference plane L of the metal particle dispersion element 15. The predetermined depth D1 is deeper than D50 of the metal particles 12 included in the metal particle dispersion element 15.