Electronic Component Bonding Strength via Lateral Surface Recesses

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Solution Overview

Problem

Conventional electronic components with coils on laminated insulating base materials face issues with bonding strength due to the interference of magnetic flux and stress concentration at bonding interfaces, leading to potential peeling off from mounting substrates when using conductive or insulating bonding materials.

Innovation Solution

The electronic components and diaphragms are designed with a smaller mounting surface area and recesses on the insulating base material substrates, allowing for increased contact area with insulating bonding materials, enhancing bonding strength without enlarging the mounting area, and using a combination of conductive and insulating bonding materials to secure the components to the substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the mounting electrode area is reduced to prevent magnetic flux interference, then the magnetic flux interference is prevented, but the bonding strength to another member is insufficient

Engineering Contradiction:

Improvemagnetic flux interferenceVSAvoidbonding strength

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The bonding function is segmented into two parts: the mounting electrode provides electrical connection with minimal magnetic flux interference, while the insulating base material layers provide mechanical bonding support through their lateral surfaces. This segmentation allows each component to fulfill its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The insulating base material layers serve multiple functions: they provide electrical insulation, structural support, and bonding surface. By utilizing the lateral surfaces of the insulating base material layers for bonding, the structure achieves both electrical isolation and mechanical attachment without requiring a large mounting electrode area.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Object-affected harmful factors

If the mounting electrode area is reduced to prevent magnetic flux interference, then the magnetic flux interference is prevented, but the bonding reliability is insufficient

Engineering Contradiction:

Improvemagnetic flux interferenceVSAvoidbonding reliability

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Device complexity

If only conductive bonding material is used to bond the mounting electrode, then the bonding process is simple, but stress concentration causes peeling at the interface

Engineering Contradiction:

Improvebonding process complexityVSAvoidbonding strength

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The bonding structure uses a composite approach where the insulating base material layers provide a broad bonding interface that distributes stress, while the conductive bonding material provides electrical connection. The combination of the insulating base material's mechanical support and the conductive bonding material's adhesive properties creates a robust bonding system that prevents stress concentration and peeling.

Inventive Principle:

Principle #40Composite materials

4Strength

If the mounting surface area is increased to improve bonding strength, then the bonding strength is improved, but the device size increases

Engineering Contradiction:

Improvebonding strengthVSAvoidmounting surface area

Core Design Contradiction:

StrengthVSArea of stationary object

Solution Approach 1:

The bonding interface is extended from the two-dimensional mounting surface to the three-dimensional lateral surfaces of the insulating base material layers. By utilizing the vertical dimension and the side surfaces of the laminated structure, the effective bonding area is increased without expanding the horizontal mounting footprint, thus maintaining compact device size while achieving strong bonding.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10770215B2Electronic component, diaphragm, electronic device, and electronic component manufacturing method

Publication Date: 2020.09.08 MURATA MFG CO LTD

AI summary

An electronic component includes an insulating base material substrate including a first main surface defining a mounting surface, a coil on the insulating base material substrate, and a mounting electrode on the first main surface and connected to the coil. The insulating base material substrate includes insulating base material layers laminated in a lamination direction. The coil includes a coil conductor provided on one of the insulating base material layers and a winding axis extending in the lamination direction. An area of the first main surface is smaller than an area of a section different in area from the first main surface and is closest to the first main surface, among sections parallel or substantially parallel to the first main surface.