Electronic Component Lead Stress Management
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Solution Overview
Problem
Existing electrolytic capacitors face reliability issues due to stress transmission from printed circuit boards with severe temperature changes, leading to potential cracks at the connecting portion between the anode body and external electrode, which hinders size reduction and capacitance enhancement.
Innovation Solution
An electronic component design featuring a lead portion with a current collector on its end surface, connected to a terminal within a sealing body, which redirects stress transmission away from the connecting portion, ensuring high reliability and miniaturization while maintaining large capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the anode body and external electrode are directly connected to reduce size, then the capacitance increases and size reduces, but stress from temperature changes causes cracks at the connecting portion, lowering reliability
Solution Approach 1:
The patent introduces a current collector as an intermediary component between the lead portion and the terminal. The current collector is formed on the end surface of the sealing body and provides a stress-absorbing interface that prevents direct stress transmission to the connecting portion, thereby solving the reliability issue without significantly increasing structural complexity
Solution Approach 2:
The patent segments the connection structure into distinct functional parts: the lead portion inside the sealing body, the current collector on the end surface, and the terminal outside. This segmentation allows each component to perform its specific function while isolating stress effects, enabling both size reduction and improved reliability
2Length of moving object
If a space is provided for bundling anode lead portions and welding to first terminal, then the connection is secure, but the electrolytic capacitor cannot meet the demand for reduction in size
Solution Approach 1:
The patent merges the functions of the current collector and terminal into a integrated structure formed on the end surface of the sealing body. This eliminates the need for separate bundling spaces and welding operations, enabling size reduction while maintaining connection reliability through the stress-absorbing current collector design
Data Source
AI summary
An electronic component includes an electronic element that includes a lead portion, a sealing body that seals the electronic element in a state where an end portion of the lead portion is exposed, a first current collector that is formed on the sealing body and is connected to the end portion, and a first terminal that includes a first portion which is sealed in the sealing body and is connected to the first current collector.