Electronic Component Internal Magnetic Path Manufacturing Method
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Solution Overview
Problem
Conventional manufacturing methods for electronic components with internal magnetic paths result in smaller cross-section areas of the magnetic paths due to positional tolerances, making it difficult to achieve high inductance values.
Innovation Solution
A manufacturing method involving the simultaneous formation of coil conductors and sacrificial conductors on the insulator substrate, followed by lamination and exposure of the sacrificial conductors to create a single process for forming both the internal magnetic path and coil conductor, reducing positional tolerances and increasing the cross-section area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If holes for internal magnetic paths and coil conductors are formed in separate processes, then manufacturing flexibility is maintained, but positional tolerance accumulates and reduces the cross-section area of the internal magnetic path
Solution Approach 1:
The patent merges the formation of holes for internal magnetic paths and the formation of coil conductors into a single integrated process. By forming both structures simultaneously using the same positioning reference (the insulator substrate), the method eliminates cumulative positional tolerance that would occur with separate processes, thereby increasing the cross-section area of the internal magnetic path while maintaining manufacturing feasibility
2Manufacturing precision
If coil conductors are distanced from holes for internal magnetic paths to account for positional tolerance, then manufacturing robustness is improved, but the cross-section area of the internal magnetic path decreases
Solution Approach 1:
The patent applies preliminary action by forming the holes for internal magnetic paths and the coil conductors at the same time during the manufacturing process. This simultaneous formation ensures that both structures are positioned relative to the same reference point, preventing the need for excessive spacing that would otherwise be required to accommodate cumulative positional tolerance from sequential processes
Data Source
AI summary
An electronic component includes a multilayer body formed by laminating an insulator substrate and a plurality of insulator layers, a coil including coil conductors provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate. A manufacturing method for the electronic component includes: forming the coil conductors and a sacrificial conductor at the same time on a mother insulator substrate, which is the assemblage of a plurality of the insulator substrates; laminating insulator sheets, which are to be the corresponding insulator layers mentioned above, on the mother insulator substrate so as to cover the coil conductors; and exposing the sacrifice conductor by removing part of the insulator sheets.