Electronic Component Magnetic Resin Underfill Flow
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Solution Overview
Problem
In electronic components with a magnetic resin layer, the high surface roughness of the magnetic resin hinders the flow of underfill between the component and the mounting substrate, leading to potential adhesion issues and manufacturing challenges.
Innovation Solution
A configuration where a high-smoothness insulating coat layer is formed on the magnetic resin layer, and terminal electrodes are selectively formed using electroless plating, enhancing underfill flowability and adhesion, while the magnetic resin layer's surface roughness is covered to facilitate solder fillet formation and reduce manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a magnetic resin layer is used to embed the passive element part, then magnetic characteristics are improved, but surface roughness increases and underfill flowability deteriorates
Solution Approach 1:
The surface of the magnetic resin layer is segmented into multiple areas: a first area with high smoothness for underfill flow, and a second area with original roughness for terminal electrode formation. This segmentation allows each area to serve its specific function optimally.
Solution Approach 2:
Different surface qualities are applied to different locations on the magnetic resin layer. The first area has high smoothness to facilitate underfill flow, while the second area maintains high roughness to enhance terminal electrode adhesion through anchor effect.
2Ease of operation
If the entire surface of the magnetic resin layer is covered to improve underfill flow, then underfill flowability is improved, but terminal electrode adhesion deteriorates
Solution Approach 1:
The magnetic resin layer surface is divided into functional zones: a first area covered with smooth insulating material for underfill access, and a second area exposed for terminal electrode formation, ensuring both underfill flow and electrode adhesion are optimized.
Solution Approach 2:
The insulating material is selectively applied only to the first area where underfill flow is needed, while the second area remains exposed to maintain its rough surface characteristics for strong terminal electrode adhesion.
3Ease of operation
If a smooth insulating layer is added to improve underfill flow, then underfill flowability is improved, but manufacturing complexity increases
Solution Approach 1:
An insulating material layer is introduced as an intermediary between the magnetic resin layer and the underfill. This intermediary provides the necessary smooth surface for underfill flow while being selectively applied to minimize its impact on other manufacturing steps.
Solution Approach 2:
The insulating material is applied only to the first area of the magnetic resin layer where underfill flow is required, rather than covering the entire surface, thus reducing the complexity of subsequent electrode formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for easy underfill flow and enhanced adhesion of terminal electrodes, improving the reliability and cost-effectiveness of electronic component mounting, with the insulating coat layer ensuring smooth underfill flow and the terminal electrodes providing anchor effects.
Implementation Method 1
terminal electrodes are selectively formed using electroless plating
Implementation Method 2
the magnetic resin layer's surface roughness is covered to facilitate solder fillet formation
Implementation Method 3
the terminal electrode is formed on the surface of the magnetic resin layer having large surface roughness, so that adhesion of the terminal electrode is enhanced by anchor effect
Data Source
AI summary
Disclosed herein is an electronic component that includes: a base having a main surface; a passive element part formed on the main surface of the base; a magnetic resin layer formed on the main surface of the base so as to embed the passive element part therein, the magnetic resin layer having a surface extending substantially parallel to the main surface of the base; an insulating coat layer formed on a first area of the surface of the magnetic resin layer, the insulating coat layer having higher smoothness than the surface of the magnetic resin layer; and a terminal electrode formed on a second area of the surface of the magnetic resin layer and electrically connected to the passive element part.