Electronic Component Module 3D Stacking for Size Reduction
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Solution Overview
Problem
Existing electronic component modules for wireless communication devices are bulky due to two-dimensional mounting of chip components on resin multilayer substrates, leading to increased size and cost.
Innovation Solution
The use of an elastic wave filter with a piezoelectric substrate and a flexible cover layer, where the electronic components are mounted above the elastic wave filter, eliminating the need for interposers and printed circuit boards, and utilizing a wiring layer for both electrical connection and reinforcement to reduce size and height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If chip components are two dimensionally mounted on the surface of the resin multilayer substrate, then electrical connection and component integration are achieved, but the size of the front-end module increases
Solution Approach 1:
The patent transitions from two-dimensional mounting of chip components on the substrate surface to three-dimensional stacking, where components are mounted both on the substrate and above it in vertical layers. This dimensional change enables higher integration density while reducing the horizontal footprint of the module.
2Adaptability or versatility
If separate interposer and printed circuit board are provided for rewiring, then electrical connection flexibility is improved, but height and cost of the module increase
Solution Approach 1:
The patent merges the functions of the interposer and printed circuit board into a single integrated substrate structure. The substrate simultaneously provides mechanical support, electrical connections, and signal routing functions, eliminating the need for separate interposer and PCB layers, thereby reducing overall module height.
3Length of stationary object
If flexible cover layer is used, then height reduction is achieved, but structural reinforcement is reduced
Solution Approach 1:
The patent employs a composite structure where the flexible cover layer is combined with the rigid substrate and mounting structures. This composite approach allows the cover layer to remain thin and flexible for height reduction while the overall assembly gains structural strength from the integrated substrate and component mounting framework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a significant downsizing of the electronic component module, improved connection reliability, and reduced thermal stress on connections, while enabling support for multiple frequency bands with reduced external terminals and line lengths.
Implementation Method 1
The elastic wave filter includes a piezoelectric substrate and a functional electrode provided on the piezoelectric substrate
Data Source
AI summary
A front-end circuit component includes a base-body elastic wave filter and a mounted electronic component. The base-body elastic wave filter includes a piezoelectric substrate and an IDT electrode on an upper surface of a piezoelectric substrate. The mounted electronic component is mounted above the piezoelectric substrate to define a sealed space in which the IDT electrode is disposed.