Electronic Component Module High-Temperature Brazing
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Solution Overview
Problem
Conventional soldering methods fail to securely fix high-temperature electronic components like SiC elements and thermoelectric modules on circuit boards, leading to peeling and reliability issues under high-temperature environments, and there is a need for lead-free solder solutions with improved manufacturability and thermal stability.
Innovation Solution
An electronic component module design using a ceramic substrate with metal plates bonded via brazing material layers of higher melting points, specifically Ag-Cu and Al-based brazing materials, to ensure stable bonding and heat management, while maintaining a lead-free composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldering is used to fix SiC elements on circuit board, then manufacturing process is simple, but fixing state becomes unstable at high temperature causing peeling
Solution Approach 1:
The patent changes the bonding parameters by using brazing instead of soldering, with brazing materials having melting points of 600°C or higher. This parameter change enables stable bonding at high temperatures (300-500°C) where conventional soldering fails, resolving the reliability issue while maintaining manufacturing feasibility through established brazing processes
Solution Approach 2:
The patent introduces brazing material layers as intermediary substances between the SiC elements and the circuit board. These brazing materials serve as mediators that can withstand high temperatures and provide stable bonding, unlike conventional solder that softens and causes peeling at elevated temperatures
2Temperature
If high temperature solder without lead is used, then operating temperature can be increased, but bonding characteristic deteriorates and manufacturability becomes difficult
Solution Approach 1:
The patent changes the bonding method from soldering to brazing, using materials with melting points of 600°C or higher. This parameter change enables operation at 300-500°C while maintaining excellent bonding characteristics, avoiding the degradation issues associated with lead-free high-temperature solder
Solution Approach 2:
The patent employs composite brazing material layers with specific compositions (such as Ag-Cu alloys or Al-based materials) that combine high-temperature resistance with good bonding characteristics. These composite materials achieve both high operating temperature capability and manufacturability
3Productivity
If element size is miniaturized to increase mounting number, then productivity increases, but thermal deformation and oscillation increase causing easier peeling
Solution Approach 1:
The patent changes the bonding method to brazing with high-melting-point materials, which provides stronger and more rigid bonds that can withstand thermal deformation and oscillation. This enables miniaturization and increased mounting density without compromising reliability against peeling from thermal stress
4Reliability
If titanium layer is used as intermediate layer for thermoelectric element, then diffusion and stress release are prevented, but manufacturability becomes difficult due to thermal spraying method
Solution Approach 1:
The patent uses brazing material layers as intermediaries between thermoelectric elements and electrodes, replacing the titanium intermediate layer. These brazing materials prevent diffusion and stress issues while enabling manufacturing through conventional brazing processes instead of complex thermal spraying methods
Solution Approach 2:
The patent substitutes the thermal spraying process with conventional brazing technology. This replacement maintains the protective function of preventing diffusion and stress while dramatically improving manufacturability through established, simpler manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses peeling and characteristic deterioration of electronic components, enhancing reliability and heat cycle performance, and allows for higher operating temperatures, even in extreme environments up to 500°C, with improved manufacturability and reduced thermal resistance.
Implementation Method 1
bonded to each other via a brazing material layer (8), which is formed of a brazing material having a melting point higher than a operating temperature of the electronic component (9)
Data Source
Figure 1~2
Figure 3~4
AI summary
An electronic component module 1 has a circuit board 2 in which metal plates 5 and 7 are bonded to both surfaces of a ceramic substrate 3, and an electronic component 9 that is bonded to at least one surface of the metal plate 5 and is operable at least 125°C. The electronic component 9 is bonded to the metal plate 5 via a brazing material layer 8 having a higher melting point than a operating temperature of the electronic component 9.